Numerical calculation of turbulent convection heat transfer over infrared dome based on SST turbulence model

2016 ◽  
Vol 45 (7) ◽  
pp. 0703002
Author(s):  
罗海波 Luo Haibo ◽  
张代军 Zhang Daijun ◽  
惠斌 Hui Bin ◽  
常铮 Chang Zheng ◽  
徐保树 Xu Baoshu
2014 ◽  
Vol 556-562 ◽  
pp. 4275-4279
Author(s):  
De Zhi Yang ◽  
Meng Long Dong ◽  
Xin Wei Lu ◽  
Zhao Yao Zhou

Fully developed turbulence single phase convection heat transfer of water in pipes filled with sintered porous metal inner rings or solid inner rings was investigated numerically respectively. Numerical calculations were conducted with the Fluent 6.3 code, using the SST k-ω turbulence model. Comparing to solid-ring turbulator pipes, porous-ring turbulator pipes have better comprehensive heat transfer effect. The maximum PEC for porous-ring turbulator pipes is 4.4 and the PEC of solid-ring turbulator pipes is less than 1. It was also analyzed effect of geometric structures on porous-ring turbulator pipe performance. f/f0 for porous-ring turbulator pipes increases with the increasing of Re while Nu/Nu0 decreases with the increasing of Re ,and PEC decreases with the increasing of Re. With the same Re, if the width of the porous ring is equal to the width of groove, f/f0, Nu/Nu0 increases and PEC decreases with the increasing height of porous ring. When the height of porous ring is constant, the f/f0, Nu/Nu0 and PEC decreases with the increasing height of porous ring under the same Re.


2008 ◽  
Vol 130 (3) ◽  
Author(s):  
E. Elsaadawy ◽  
H. Mortazavi ◽  
M. S. Hamed

Although the problem of 2D ribbed channels has been studied heavily in the literature as a benchmark or basic case for cooling of electronic packing, there is still a contradiction in the literature about the suitable turbulence model that should be used in such a problem. The accuracy of the computational predictions of heat transfer rates depends mostly on the choice of the proper turbulence model that is capable of capturing the physics of the problem, and on the corresponding wall treatment. The main objective of this work is to identify the proper turbulence model to be used in thermal analysis of electronic systems. A number of available turbulence models, namely, the standard k-ε, the renormalization group k-ε, the shear stress transport (SST), the k-ω, and the Reynolds stress models, have been investigated. The selection of the most appropriate turbulence model has been based upon comparisons with both direct numerical simulations (DNSs) and experimental results of other works. Based on such comparisons, the SST turbulence model has been found to produce results in very good agreement with the DNS and experimental results and hence it is recommended as an appropriate turbulence model for thermal analysis of electronic packaging.


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