Measurement system of surface topography for diamond grinding wheel

A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface topography of a #3000 diamond grinding wheel, and a large sampling area could be achieved by its stitching capability without compromising its lateral or vertical resolution. The protrusion height distribution of diamond grains and the static effective grain density of the grinding wheel were derived, and the wheel chatter and the deformation of the wheel were analyzed as well. The study shows that the grain protrusion height obeys an approximate normal distribution, the static effective grain density is much lower than the theoretical density, and only a small number of diamond grains are effective in the grinding process with fine diamond grinding wheel. There exists waviness on the grinding wheel surface parallel with the wheel cutting direction. The cutting surface of the grinding wheel is not flat but umbilicate, which indicates that the elastic deformation at the wheel edges is much larger than in the center region.

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Measurement and evaluation of the surface topography of fine diamond grinding wheel

Journal of Mechanical Engineering ◽

10.3901/jme.2007.10.108 ◽

2007 ◽

Vol 43 (10) ◽

pp. 108 ◽

Cited By ~ 8

Author(s):

Fengwei HUO

Keyword(s):

Surface Topography ◽

Grinding Wheel ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Fine Diamond ◽

Measurement And Evaluation

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Characterization of surface topography of metal bonded diamond grinding wheel.

Journal of the Japan Society for Precision Engineering ◽

10.2493/jjspe.55.185 ◽

1989 ◽

Vol 55 (1) ◽

pp. 185-190

Author(s):

Jun'ichi TAMAKI ◽

Seiki MATSUI

Keyword(s):

Surface Topography ◽

Grinding Wheel ◽

Diamond Grinding Wheel ◽

Diamond Grinding

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Simulation of Diamond Grinding Wheel to Characterize the Surface Topography.

Journal of the Japan Society for Precision Engineering ◽

10.2493/jjspe.65.581 ◽

1999 ◽

Vol 65 (4) ◽

pp. 581-585

Author(s):

Katsumi MIZUTANI ◽

Tsuneo KAWANO ◽

Kazutoshi ADACHI ◽

Nobuo KUMAGAI

Keyword(s):

Surface Topography ◽

Grinding Wheel ◽

Diamond Grinding Wheel ◽

Diamond Grinding

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Stitching for a large area of surface topography analysis of diamond grinding wheel

10.1117/12.2014732 ◽

2013 ◽

Author(s):

Shuang Wang ◽

Changcai Cui ◽

Chunqi Huang ◽

Hui Huang ◽

Ruifang Ye ◽

...

Keyword(s):

Surface Topography ◽

Grinding Wheel ◽

Large Area ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Topography Analysis

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Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.487.1 ◽

2011 ◽

Vol 487 ◽

pp. 1-5

Author(s):

Shang Gao ◽

Ren Ke Kang ◽

Y. Li ◽

Hang Gao

Keyword(s):

Surface Topography ◽

Subsurface Damage ◽

Grinding Wheel ◽

Grinding Wheels ◽

Cdznte Substrate ◽

Diamond Grinding Wheel ◽

Diamond Grinding ◽

Damage Layer ◽

Cdznte Detectors ◽

Cdznte Substrates

Surface and subsurface damage affect the preparation of high-resolution HgCdTe and CdZnTe detectors. Grinding experiments were performed on CdZnTe substrates with the grinding wheels of different abrasive sizes. The surface topography and subsurface damages of CdZnTe substrates ground by diamond grinding wheels with different grit sizes were studied. The effects of the grit sizes of grinding wheels on the surface topography and subsurface damage of CdZnTe substrates were discussed. The surface roughness and subsurface damage layer depth of CdZnTe after grinding with #3000 diamond grinding wheel are only Ra 7 nm and 100 nm, proved that grinding is of great potential for CdZnTe substrate processing.

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