Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel

2011 ◽  
Vol 487 ◽  
pp. 1-5
Author(s):  
Shang Gao ◽  
Ren Ke Kang ◽  
Y. Li ◽  
Hang Gao

Surface and subsurface damage affect the preparation of high-resolution HgCdTe and CdZnTe detectors. Grinding experiments were performed on CdZnTe substrates with the grinding wheels of different abrasive sizes. The surface topography and subsurface damages of CdZnTe substrates ground by diamond grinding wheels with different grit sizes were studied. The effects of the grit sizes of grinding wheels on the surface topography and subsurface damage of CdZnTe substrates were discussed. The surface roughness and subsurface damage layer depth of CdZnTe after grinding with #3000 diamond grinding wheel are only Ra 7 nm and 100 nm, proved that grinding is of great potential for CdZnTe substrate processing.

2008 ◽  
Vol 389-390 ◽  
pp. 36-41
Author(s):  
Feng Wei Huo ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin

A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface topography of a #3000 diamond grinding wheel, and a large sampling area could be achieved by its stitching capability without compromising its lateral or vertical resolution. The protrusion height distribution of diamond grains and the static effective grain density of the grinding wheel were derived, and the wheel chatter and the deformation of the wheel were analyzed as well. The study shows that the grain protrusion height obeys an approximate normal distribution, the static effective grain density is much lower than the theoretical density, and only a small number of diamond grains are effective in the grinding process with fine diamond grinding wheel. There exists waviness on the grinding wheel surface parallel with the wheel cutting direction. The cutting surface of the grinding wheel is not flat but umbilicate, which indicates that the elastic deformation at the wheel edges is much larger than in the center region.


2014 ◽  
Vol 22 (12) ◽  
pp. 3167-3174 ◽  
Author(s):  
崔长彩 CUI Chang-cai ◽  
余卿 YU Qing ◽  
张遨 ZHANG Ao ◽  
李瑞旭 LI Rui-xu ◽  
黄辉 HUANG Hui ◽  
...  

2010 ◽  
Vol 42 ◽  
pp. 313-316 ◽  
Author(s):  
Jin Xue Xue ◽  
Bo Zhao

In order to investigate the influence of dressing methods on grinding temperature, two kinds of diamond grinding wheels dressed by traditional dressing(TD) and elliptic ultrasonic vibration dressing(ED) respectively were used to grind the same nano-ceramic material. Through grinding experiments, the comparative analysis of the grinding temperature was conducted. The results show that diamond grinding wheel dressed by elliptical ultrasonic vibration method can decrease the grinding temperature.


2011 ◽  
Vol 415-417 ◽  
pp. 594-597 ◽  
Author(s):  
Hua Xu ◽  
Cui Jiao Liao ◽  
Qing Ming Weng

To improve the self-sharpening ability and increase clearance for debris of metal bonded diamond grinding wheel, the porosity structure is applied to the diamond grinding wheel in this paper. By selecting different inducers diamond composites are burned under appropriate agglomeration condition. The experiment results indicate that diamond composites obtained through two certain inducers can meet both the demand of pore-creating and intensity, so can be used to make wheels. This conclusion lays a foundation for further study.


2011 ◽  
Vol 299-300 ◽  
pp. 1060-1063 ◽  
Author(s):  
Y.X. Yao ◽  
Jin Guang Du ◽  
Jian Guang Li ◽  
H. Zhao

Mill-grinding experiments were carried out on SiCp/Al to investigate effects of mill-grinding parameters and grinding wheel parameters on machined surface roughness in this paper. The machined surface topography was also analyzed. Experimental results show that surface roughness increases with increasing feed rate and the depth of the mill-grinding. The effect of mill-grinding speed on surface roughness is low. The machined surface reveals many defects. The fine grit diamond grinding wheel can reduce the surface roughness and decrease the machined surface defect. Compared to the vitrified bonded diamond and electroplated diamond grinding wheels used in the experiment, the resin-based diamond grinding wheel produces a better surface.


2017 ◽  
Vol 872 ◽  
pp. 19-24
Author(s):  
Zong Chao Geng ◽  
Shang Gao ◽  
Ren Ke Kang ◽  
Zhi Gang Dong

Quartz glass is a typical hard and brittle material. During the manufacturing process of quartz glass components, ultra-precision grinding is widely used due to its high throughput and good dimensional accuracies. However, grinding will unavoidably induce large surface and subsurface damage. In this study, the surface and subsurface damage characteristics of quartz glass substrates ground by diamond wheels with different grit sizes were investigated in terms of surface roughness, surface topography, subsurface microcrack characteristic, and subsurface damage depth. Discussion was also provided to explore corresponding reasons of surface and subsurface damage induced by diamond grinding wheels with different grit sizes of #1500 and #2000. The experiment results showed that the surface roughness, surface damage, and subsurface damage depth induced by #2000 quartz glass was ground by #1500 diamond grinding wheel, and in ductile mode when ground by #2000 diamond grinding wheel.


1999 ◽  
Vol 65 (4) ◽  
pp. 581-585
Author(s):  
Katsumi MIZUTANI ◽  
Tsuneo KAWANO ◽  
Kazutoshi ADACHI ◽  
Nobuo KUMAGAI

Author(s):  
P. Suya Prem Anand ◽  
N. Arunachalam ◽  
L. Vijayaraghavan

Advanced ceramic materials like sintered and presintered zirconia are frequently used in biomedical applications, where minimum quantity lubrication (MQL) assisted grinding is required to achieve a good surface finish instead of conventional flood coolant. However, insufficient cooling and wheel clogging are the major problems that exist in the MQL grinding process, which depends upon the type of work piece material and the grinding wheel being used. The present study is to determine the performance of the grinding wheels on presintered zirconia under MQL conditions in terms of grinding forces, specific energy, surface integrity, and wheel wear. Experiments are conducted with two different types of grinding wheels as silicon carbide (SiC) and diamond grinding wheels under the same condition. The results indicated that the diamond wheel provided a better surface finish and reduced tangential force under MQL condition, compared to the conventional SIC wheel. This was due to the reduction of wheel loading in the diamond grinding wheel. The specific energy of diamond grinding wheel was reduced with higher material removal rate compared to the conventional SiC wheel. The ground surfaces generated by the diamond grinding wheel showed fine grinding marks with better surface finish. The percentage of G-ratio calculated for the diamond wheel was higher than the SiC wheel by 77%. This was due to the sliding of the grains and less wheel loading in the diamond wheel. The cost difference between the corresponding wheels was discussed to improve the productivity of the grinding process.


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