Surface Roughness Prediction of SiC Monocrystalline Cut by Diamond Wire-saw 
Excited by Transverse Ultrasonic Vibration

In this paper, on the basis of a large number of literature at home and abroad are summarized, we used the complete with independent intellectual property rights ultrasound wire-cutting processing machine tool to carry out machining experiment , and the ultrasonic wire cutting mechanism and process was carried out in-depth study. The results showed: compared with ordinary sawing, the cutting efficiency of applying ultrasonic action was high, its cutting force and surface roughness was small, at the same time ,used the software of ABAQUS finite element simulation analysis, and further studied on the law of electroplated diamond wire saw ultrasonic vibration cutting of composite processing technology process.

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Surface roughness prediction model in ultrasonic vibration assisted grinding of BK7 optical glass

Journal of Central South University ◽

10.1007/s11771-018-3736-5 ◽

2018 ◽

Vol 25 (2) ◽

pp. 277-286 ◽

Cited By ~ 5

Author(s):

Pei-yi Zhao ◽

Ming Zhou ◽

Yuan-jing Zhang ◽

Guo-chao Qiao

Keyword(s):

Surface Roughness ◽

Prediction Model ◽

Ultrasonic Vibration ◽

Optical Glass ◽

Surface Roughness Prediction ◽

Roughness Prediction ◽

Ultrasonic Vibration Assisted Grinding

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Surface roughness prediction in ultrasonic vibration-assisted milling

Journal of Advanced Mechanical Design Systems and Manufacturing ◽

10.1299/jamdsm.2020jamdsm0063 ◽

2020 ◽

Vol 14 (4) ◽

pp. JAMDSM0063-JAMDSM0063 ◽

Cited By ~ 1

Author(s):

Yixuan FENG ◽

Fu-Chuan HSU ◽

Yu-Ting LU ◽

Yu-Fu LIN ◽

Chorng-Tyan LIN ◽

...

Keyword(s):

Surface Roughness ◽

Ultrasonic Vibration ◽

Surface Roughness Prediction ◽

Roughness Prediction

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Study on Thin Diamond Wire Slicing with Taguchi Method

Materials Science Forum ◽

10.4028/www.scientific.net/msf.505-507.1219 ◽

2006 ◽

Vol 505-507 ◽

pp. 1219-1224 ◽

Cited By ~ 5

Author(s):

Pei Lum Tso ◽

Bo Huei Yan ◽

Chan Hsing Lo

Keyword(s):

Surface Roughness ◽

Taguchi Method ◽

Material Removal Rate ◽

Feed Rate ◽

Material Removal ◽

Removal Rate ◽

Processing Parameters ◽

Diamond Wire ◽

Wire Saw ◽

Diamond Wire Saw

Presently, the loose abrasive wire saw is the most commonly used technique for slicing hard and brittle materials. However its productivity is relatively low. A diamond wire saw has been developed for slicing brittle materials such as silicon wafer. The objects of this paper is to make the thin diamond wire saw apply to high cost production in semiconductor industries with the effective processing parameters such as machined surface roughness, material removal rate, the wear of the wire and the kerf width of the slicing. Effects of processing parameters on the performance of the diamond wire sawing processes are investigated by using the Taguchi method for this design of experiment (DOE). The analysis of the result shows that the optimal combinations for good surface roughness are small grain size, high wire speed, and low feed rate. Wire speed and feed rate are positively related to material removal rate.

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Fixed Abrasive Diamond Wire Saw Slicing of Single Crystal SiC Wafers

Manufacturing ◽

10.1115/imece2003-41836 ◽

2003 ◽

Cited By ~ 6

Author(s):

Craig W. Hardin ◽

Jun Qu ◽

Albert J. Shih

Keyword(s):

Surface Roughness ◽

Subsurface Damage ◽

Acoustic Microscope ◽

Diamond Wire ◽

Wire Saw ◽

Diamond Wire Saw ◽

Single Crystal Sic ◽

Wire Cutting ◽

Scanning Acoustic Microscope ◽

Fixed Abrasive

This paper investigates the slicing of single crystal SiC with a fixed abrasive diamond wire. A spool-to-spool rocking motion diamond wire saw machine using a 0.22 mm nominal diameter diamond wire with electroplated bond and 20 μm average size diamond grit is used. The effect of wire downfeed speed on wafer surface roughness and subsurface damage is first investigated. The surface marks due to the loose diamond and stagnation of the wire during the change in wire cutting direction are studied. A scanning acoustic microscope is explored as a non-destructive evaluation method to identify the level of subsurface damage. Another set of tests investigates the effects of using a new diamond wire on the cutting forces and surface roughness. Scanning electron microscopy (SEM) is applied to examine the machined surfaces and the diamond wire wear. This study demonstrated the feasibility of fixed abrasive diamond wire cutting of SiC wafers and the usage of a scanning acoustic microscope to study the machining subsurface damage.

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Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.431-432.25 ◽

2010 ◽

Vol 431-432 ◽

pp. 25-28 ◽

Cited By ~ 2

Author(s):

Li Gang Zhao ◽

Dun Wen Zuo ◽

Yu Li Sun ◽

Min Wang

Keyword(s):

Surface Roughness ◽

Experimental Research ◽

Linear Velocity ◽

Feed Speed ◽

Diamond Wire ◽

Wire Saw ◽

Diamond Wire Saw ◽

The Wire ◽

Fixed Diamond Wire

The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed Vs and the linear velocity of the wire saws Vw were analyzed.

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