scholarly journals A hybrid technique using modified ICP algorithm for faster and automatic 2D & 3D microscopic image stitching in cytopathologic examination

2019 ◽  
Vol 56 (15) ◽  
pp. 151002
Author(s):  
颜振翔 Zhenxiang Yan ◽  
王寒迎 Hanying Wang ◽  
石齐双 Qishuang Shi ◽  
莫艳红 Yanhong Mo ◽  
杨辉华 Huihua Yang

2014 ◽  
Vol 1049-1050 ◽  
pp. 398-401
Author(s):  
Juan Juan Yin ◽  
Guo Jian Cheng ◽  
Na Liu ◽  
Xin Jian Qiang ◽  
Ye Liu

Because of the inherent conflict between visual area and resolution in rock microscope structure, during the study of the RCTS (Rock Core Thin Section) microstructure, we cannot focus on the multi-scale structure characteristics of the particles, pores and throats, and it is fail to satisfy the demands of a more comprehensive study. In order to solve this problem, a microscopic image stitching method in RCTS is proposed by applying SIFT (Scale Invariant Feature Transform) detection algorithm. This method can successfully solve the conflict between the visual area and resolution, overcoming the problem of inclining and deformation in images acquisition under the microscope and finally, achieving the seamless stitching of RCTS microscopic image for big visual area. The experimental results show that this method can improve the accuracy of rock analysis in microstructure and has important practical and theoretical significance for the development of tight sandstone reservoir.


Author(s):  
Pramit Ghosh ◽  
Ratnadeep Dey ◽  
Kaushiki Roy ◽  
Debotosh Bhattacharjee ◽  
Mita Nashipuri

2013 ◽  
Vol 21 (5) ◽  
pp. 5974 ◽  
Author(s):  
Dong Liu ◽  
Shitong Wang ◽  
Pin Cao ◽  
Lu Li ◽  
Zhongtao Cheng ◽  
...  

Author(s):  
Thomas M. Moore

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.


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