A study on the radiation resistance of CdWO4 thin-film scintillators deposited by using an electron-beam physical vapor deposition method

2016 ◽  
Vol 69 (5) ◽  
pp. 734-738
Author(s):  
Seyong Park ◽  
Young Soo Yoon
Keyword(s):  
Thin Film ◽  
Electron Beam ◽  
Vapor Deposition ◽  
Radiation Resistance ◽  
Physical Vapor Deposition ◽  
Deposition Method ◽  
Physical Vapor Deposition Method

Fatigue strength of an (α + β)-type titanium alloy Ti-6Al-4V produced by the electron-beam physical vapor deposition method

2006 ◽  
Vol 38 (6) ◽  
pp. 651-658 ◽  
Author(s):  
O. N. Gerasimchuk ◽  
G. A. Sergienko ◽  
V. I. Bondarchuk ◽  
A. V. Terukov ◽  
Yu. S. Nalimov ◽  
...  
Keyword(s):  
Titanium Alloy ◽  
Electron Beam ◽  
Fatigue Strength ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Deposition Method ◽  
Physical Vapor Deposition Method

Tetramer bis-(8-hydroxyquinoline) Zinc Crystals Prepared by Physical Vapor Deposition Method

2017 ◽  
Vol 52 (12) ◽  
pp. 1700229 ◽  
Author(s):  
Zhixian Wei ◽  
Hui Song ◽  
Chenghu Dai ◽  
Zhen Chen ◽  
Xueyu Yan ◽  
...  
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Deposition Method ◽  
Physical Vapor Deposition Method

DEPOSITION OF THIN FILM COPPER NANOSTRUCTURES BY ELECTRON BEAM PHYSICAL VAPOR DEPOSITION TECHNIQUE ON SiO2/p-TYPE Si(100) AND STUDY OF ITS OXIDATION BEHAVIOR

2011 ◽  
Vol 25 (19) ◽  
pp. 2567-2574 ◽  
Author(s):  
M. YEGANEH ◽  
M. SAREMI
Keyword(s):  
Thin Film ◽  
Electron Beam ◽  
Integrated Circuits ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Oxidation Behavior ◽  
X Ray Diffraction ◽  
Vapor Deposition Technique ◽  
Physical Vapor Deposition Technique ◽  
P Type

Electron beam physical vapor deposition (EBPVD) is being used in coating components for many applications such as for producing nanostructures and integrated circuits (ICs) coating in electronic industry. In this work, copper was deposited on the SiO 2/p-type Si (100). Thin film characteristics are investigated by scanning electron microscopy and X-ray diffraction (XRD). Then oxidation behavior of deposits was evaluated by Dektak Surface Profiler and weight gain method at 200 and 300°C. Results showed that thin film copper deposited by EBPVD has better oxidation characteristics in comparison with copper foil.

Self-Assembly of Te Nanomaterials

2007 ◽  
Vol 121-123 ◽  
pp. 287-290 ◽  
Author(s):  
Ke Feng Cai ◽  
Q. Lei ◽  
C. Yan ◽  
L.C. Zhang
Keyword(s):  
Formation Mechanism ◽  
Vapor Deposition ◽  
Self Assembly ◽  
Physical Vapor Deposition ◽  
Starting Material ◽  
Deposition Method ◽  
Physical Vapor Deposition Method

Te nanomaterials, with different morphologies, such as nanospheres, micro- and nanobranches, and microtrees with tubular nanobranches were prepared by physical vapor deposition method, using elemental Te powder as starting material. The composition and morphology of the nanomaterials were characterized by XRD, SEM/EDX and TEM. The formation mechanism of the above mentioned nanostructures was proposed.

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