Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices

2007 ◽  
pp. 1505-1508
Author(s):  
Pierre Marie Geffroy ◽  
Jean François Silvain
Keyword(s):  
Thermal Properties ◽  
Thermal Management ◽  
High Power ◽  
Electronic Devices ◽  
Power Electronic ◽  
Matrix Composites ◽  
Composites Materials ◽  
Materials Used

Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop

2003 ◽  
Author(s):  
Laura J. Meyer ◽  
Leslie M. Phinney
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Electronic Devices ◽  
Maximum Size ◽  
Power Electronic ◽  
Power Devices ◽  
Pressure Balance ◽  
Capillary Pumped Loop ◽  
Two Phase ◽  
Bandgap Semiconductors

Wide bandgap semiconductors such as SiC and GaN are materials that are advantageous for high power electronic devices. High power devices generate large amounts of energy that must be removed, and traditional cooling methods are insufficient for maintaining the desired operating temperatures. Thus, thermal management methods for high power electronic devices need to be developed. A SiC micro-capillary pumped loop thermal management system is being evaluated to cool SiC high power devices. Mathematical models incorporating two-phase flow and capillary wicking have been developed to analyze capillary pumped loops or loop heat pipes. This investigation uses a model based on the methodology of Dickey and Peterson (1994). The model takes an energy balance on the condenser and evaporator regions, as well as a pressure balance across the meniscus. A parametric study has been performed on the micro-CPL to determine the best design for a p-i-n diode that is less than 1 cm square and which produces a heat flux at the junction of over 300 W/cm2. The micro-CPL will be limited to a maximum size of 6.5 cm2. The liquid and vapor line lengths, number of grooves, and groove dimensions are varied to determine optimal values. The results and trends of the optimization calculations are discussed.

Topology Optimization of High Power Electronic Devices

2001 ◽  
pp. 119-131
Author(s):  
Ronald H. W. Hoppe ◽  
Svetozara Petrova ◽  
Volker Schulz
Keyword(s):  
Topology Optimization ◽  
High Power ◽  
Electronic Devices ◽  
Power Electronic

scholarly journals Development of Technology for High-Power Industry Converters

2019 ◽  
Vol 8 (10) ◽  
pp. 3130-3132 ◽  
Keyword(s):  
Wind Turbines ◽  
High Power ◽  
Electronic Devices ◽  
Relevant Information ◽  
Power Industry ◽  
Power Converter ◽  
Power Electronic ◽  
Photo Voltaic ◽  
Universal Procedure

The power stable of the converters is actually coming from some milliwatts (as in a cellphone) to dozens of megawatts in an HVDC gearbox body. Along with "classic" electronic devices, power streams, as well as current, are actually utilized to hold relevant information, whereas along with power electronic devices, they lug power. This inverter may magnify source of power like gas- mobiles, little wind turbines, as well as photo-voltaic assortments (i.e. it agrees with for circulated power treatments). The principles of resources and also changes are actually described and also categorized. Coming from the general regulations of resource propinquities, a universal procedure of power converter formation exists.

Embedded Microjets for Thermal Management of High Power-Density Electronic Devices

2019 ◽  
Vol 9 (2) ◽  
pp. 269-278 ◽  
Author(s):  
Stephen M. Walsh ◽  
Bernard A. Malouin ◽  
Eric A. Browne ◽  
Kevin R. Bagnall ◽  
Evelyn N. Wang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Power Density ◽  
High Power ◽  
Electronic Devices ◽  
High Power Density
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