Composite Materials for Thermal Expansivity Matching and High Heat Flux Thermal Management

2007 ◽  
pp. 1017-1020
Author(s):  
Anthony Kelly
Keyword(s):  
Heat Flux ◽  
Composite Materials ◽  
Thermal Management ◽  
High Heat ◽  
Thermal Expansivity ◽  
High Heat Flux

Composite Materials for Thermal Expansivity Matching and High Heat Flux Thermal Management

2007 ◽  
Vol 334-335 ◽  
pp. 1017-1020 ◽  
Author(s):  
Anthony Kelly
Keyword(s):  
Heat Flux ◽  
Thermal Expansion ◽  
Composite Materials ◽  
Thermal Management ◽  
Practical Problem ◽  
High Heat ◽  
Thermal Expansivity ◽  
High Heat Flux

A description is given of a possible solution of an important practical problem in microelectronics, namely producing a material of thermal expansion coeffiecient to equal that of silicon.

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

2009 ◽  
Author(s):  
Ihtesham Chowdhury ◽  
Ravi Prasher ◽  
Kelly Lofgreen ◽  
Sridhar Narasimhan ◽  
Ravi Mahajan ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Flux ◽  
Thermal Management ◽  
High Performance ◽  
High Heat ◽  
Thermoelectric Device ◽  
High Heat Flux ◽  
General Will ◽  
Site Specific ◽  
Fully Integrated

We have recently reported the first ever demonstration of active cooling of hot-spots of >1 kW/cm2 in a packaged electronic chip using thin-film superlattice thermoelectric cooler (TEC) cooling technology [1]. In this paper, we provide a detailed account of both experimental and theoretical aspects of this technological demonstration and progress. We have achieved cooling of as much as 15°C at a location on the chip where the heat-flux is as high as ∼1300 W/cm2, with the help of a thin-film TEC integrated into the package. To our knowledge, this is the first demonstration of high heat-flux cooling with a thin-film thermoelectric device made from superlattices when it is fully integrated into a usable electronic package. Our results, which validate the concept of site-specific micro-scale cooling of electronics in general, will have significant potential for thermal management of future generations of microprocessors. Similar active thermal management could also be relevant for high-performance solid-state lasers and power electronic chips.

MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

2001 ◽  
Vol 25 (5) ◽  
pp. 231-242 ◽  
Author(s):  
Cristina H. Amon ◽  
Jayathi Murthy ◽  
S.C. Yao ◽  
Sreekant Narumanchi ◽  
Chi-Fu Wu ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
High Heat ◽  
High Heat Flux ◽  
Droplet Impingement ◽  
Cooling Of Electronics
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