An Experimental Study of the Formation of Tool Marks Made by Facet Diamond Cutting Tools in Single-Point Diamond Turning

2007 ◽  
pp. 544-549
Author(s):  
Ming Chu Kong ◽  
Wing Bun Lee ◽  
Chi Fai Cheung ◽  
S. To
Keyword(s):  
Experimental Study ◽  
Single Point ◽  
Cutting Tools ◽  
Diamond Turning ◽  
Diamond Cutting ◽  
Tool Marks ◽  
Diamond Cutting Tools

An Experimental Study of the Formation of Tool Marks Made by Facet Diamond Cutting Tools in Single-Point Diamond Turning

2007 ◽  
Vol 364-366 ◽  
pp. 544-549
Author(s):  
Ming Chu Kong ◽  
Wing Bun Lee ◽  
Chi Fai Cheung ◽  
Suet To
Keyword(s):  
Single Point ◽  
Cutting Tools ◽  
Electroless Nickel ◽  
Diamond Turning ◽  
Diamond Cutting ◽  
Machined Surface ◽  
Fundamental Study ◽  
Tool Marks ◽  
Tool Mark ◽  
Diamond Cutting Tools

The formation of tool marks in single-point diamond turning is a fundamental study of the effect of materials swelling and recovery on surface roughness on a machined surface. A series of orthogonal face cutting tests has been conducted among plate aluminum alloy, oxygen-free high conductivity copper and electroless nickel phosphorus under the same cutting conditions by the use of facet tools with different front clearance angles. The results show that the regular width of the undulating pattern in tool marks could be explained by side swelling and the micro-waviness within a tool mark is caused by burnishing and recovery.

Manufacturing Process of Terahertz Radar Reflector Based on Ultra-Precision Machining Technology

2015 ◽  
Vol 713-715 ◽  
pp. 633-636
Author(s):  
Di Li ◽  
Song Bao Luo ◽  
Jian Ming Zhang ◽  
Chang Yu Xu ◽  
Chang Tao Pang
Keyword(s):  
Single Point ◽  
Cutting Tools ◽  
Diamond Turning ◽  
Precision Machining ◽  
Diamond Cutting Tools ◽  
Single Crystal Diamond ◽  
Aluminum Sample ◽  
Ultra Precision ◽  
The Cost ◽  
Better Than

This paper presents a technique for processing Terahertz radar reflector by SPDT (Single Point Diamond Turning) based on LODTM (Large Optics Diamond Turning Machine). This technique applies single crystal diamond cutting tools for ultra-precision machining, and thus could obtain high-precision optical mirror, which could be used as the Terahertz radar reflectors. An experiment for aluminum sample had been done to demonstrate the availability of the technique, and a pair of Terahertz radar reflectors were obtained. The precision of the reflectors, detected through precision coordinate measuring technology, was better than the designed requirement. The experiment results showed that Terahertz radar reflectors generated by deterministic ultra-precision machining technique based on LODTM would have advantages in figure accuracy and roughness and so on, which could be helpful to improve the precision and low the cost of Terahertz radar system.

Edge Contour Measurement of Single Point Diamond Cutting Tools by an Optical Probe

2012 ◽  
Vol 523-524 ◽  
pp. 925-931 ◽  
Author(s):  
Sung Ho Jang ◽  
Yuki Shimizu ◽  
Takemi Asai ◽  
So Ito ◽  
Wei Gao
Keyword(s):  
Laser Beam ◽  
Single Point ◽  
Cutting Tools ◽  
Optical Probe ◽  
Cutting Edge ◽  
Light Spot ◽  
Objective Lens ◽  
Diamond Cutting ◽  
Diamond Cutting Tools ◽  
Diamond Cutting Tool

This paper presents an optical probe employed for edge contour measurement of single point diamond cutting tools. The laser beam from a laser diode (LD) is focused by an objective lens to form a small light spot with a radius of approximately 20 μm, and is then received by a photodiode (PD) after passed through the focal point of the objective lens. The cutting edge of the tool, which is placed on a line with the LD and the PD, is inserted into the laser beam section. At an each X-position, the output of the PD is recorded while the light spot is moved along the Z-direction, scanning across the cutting edge of the tool with its rake face aligned in the XZ plane. The Z-position of the cutting edge is evaluated by determining a specific value from the obtained outputs of the PD. The edge contour of the diamond cutting tool can thus be measured by repeating the Z-scanning at different X-positions. Computer simulation was carried out to investigate the influences of error factors on the evaluation of the cutting edge. Experiments were also carried out to measure a round nose of a tool with nominal nose radius of 2 mm.

Microstructure, Mechanical and Wear Behaviors of Hot-Pressed Copper-Nickel-Based Materials for Diamond Cutting Tools

2017 ◽  
Vol 26 (8) ◽  
pp. 4046-4055 ◽  
Author(s):  
G. Miranda ◽  
P. Ferreira ◽  
M. Buciumeanu ◽  
A. Cabral ◽  
M. Fredel ◽  
...  
Keyword(s):  
Cutting Tools ◽  
Diamond Cutting ◽  
Copper Nickel ◽  
Diamond Cutting Tools

Preparation and properties of Al2O3-reinforced Cu-Ni-Sn metallic matrix for applications in diamond-cutting tools

2020 ◽  
Vol 109 ◽  
pp. 108025
Author(s):  
Feng Chen ◽  
Zhiqiao Yan ◽  
Zhenpeng Liu ◽  
Ying Long ◽  
Naike Fu ◽  
...  
Keyword(s):  
Cutting Tools ◽  
Metallic Matrix ◽  
Diamond Cutting ◽  
Diamond Cutting Tools

Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

2014 ◽  
Author(s):  
Hossein Mohammadi ◽  
H. Bogac Poyraz ◽  
Deepak Ravindra ◽  
John A. Patten
Keyword(s):  
Fiber Laser ◽  
Cutting Tool ◽  
Single Point ◽  
Diamond Turning ◽  
Depth Of Cut ◽  
Beam Diameter ◽  
Diamond Cutting ◽  
Laser Assisted Machining ◽  
Diamond Cutting Tool ◽  
Si Wafer

In this study, single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (μ-LAM) technique. The μ-LAM system is used to preferentially heat and thermally soften the work piece material in contact with a diamond cutting tool. In μ-LAM the laser and cutting tool are integrated into a single package, i.e. the laser energy is delivered by a single mode fiber laser to and through a diamond cutting tool. This hybrid method can potentially increase the critical depth of cut (DoC), i.e., a larger ductile-to-brittle transition (DBT) depth, in ductile regime machining, resulting in a higher material removal rate (MRR). An IR continuous wave (CW) fiber laser, wavelength of 1064nm and max power of 100W with a beam diameter of 10μm, is used in this investigation. In the current study SPDT tests were employed on single crystal silicon (Si) wafer which is very brittle and hard to machine by conventional methods. Different outputs such as surface roughness and depth of cut for different set of experiments were analyzed. Results show that an unpolished surface of a Si wafer can be machined in one pass to get a very good surface finish. The Ra was brought down from 1.2μm to 275nm only in one pass which is a very promising result for machining the Si wafer.

Sign in / Sign up

Export Citation Format

Share Document