Wettability of Carbon Nanotubes with Molten Sn-Ag-Cu Solder Alloy

2013 ◽  
Vol 372 ◽  
pp. 136-142 ◽  
Author(s):  
Suchart Chantaramanee ◽  
Sirikul Wisutmethangoon ◽  
Lek Sikong ◽  
Thawatchai Plookphol
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Wetting Angle ◽  
Lead Free Solder ◽  
Sessile Drop Technique ◽  
Single Walled Carbon Nanotube ◽  
Plating Method ◽  
Free Solder ◽  
Increasing Temperature ◽  
Drop Technique

The purpose of this work was to study the wettability of single-walled carbon nanotube (SWCNTs) and molten 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloy. The SWCNTs was coated with silver (Ag) by using an electroless plating method in order to enhance its wettability. The wetting behavior of molten SAC305 alloy on three different substrates, alumina, un-coated SWCNTs and Ag-coated SWCNTs was investigated by employing a modified sessile drop technique. The wetting angle between the molten SAC305 and the three substrates was measured at temperature range of 250-550 °C. The average wetting angles between the molten SAC305 and the alumina, the un-coated SWCNTs and the Ag-coated SWCNTs substrates were 130.7±1.3°, 128.4±4.2° and 120.1±3.5°, respectively. The wettabilty of the SWCNTs was improved by coating it with silver. The wetting angle of the Ag-coated SWCNTs was decreased approx. 9° compared to that of the un-coated. Increasing temperature has slightly affected on the wettability of SWCNTs and the molten SAC305.

Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

2019 ◽  
Vol 32 (1) ◽  
pp. 19-23 ◽  
Author(s):  
Ahmet Mustafa Erer ◽  
Serkan Oguz
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Cu Substrate ◽  
Wetting Properties ◽  
Free Solder ◽  
Drop Technique

Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

WETTING OF YBCO BY LIQUID SILVER

2003 ◽  
Vol 17 (04n06) ◽  
pp. 960-965
Author(s):  
G. A. COSTA ◽  
P. MELE ◽  
A. LIONELLO ◽  
L. MORBELLI
Keyword(s):  
Partial Melting ◽  
Sessile Drop ◽  
Temporal Evolution ◽  
Wetting Angle ◽  
Sessile Drop Technique ◽  
Liquid Silver ◽  
Eds Analysis ◽  
Drop Technique

The sessile drop technique was used to study the wettability behaviour of silver on sintered YBCO substrates. The temporal evolution of wetting angle at a temperature of 980°C is reported. SEM/EDS analysis on both surface and sectian of YBCO/Ag samples was performed: silver collects in particles, filling substrate pores in a layer of 200 microns under the silver drop. In this superficial region silver also induces partial melting of YBCO at a temperature highly lower than usual. The nature of this phenomenon is explained.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Studies of the wetting characteristics of liquid iron on dense alumina by the X-ray sessile drop technique

2003 ◽  
Vol 34 (2) ◽  
pp. 193-199 ◽  
Author(s):  
E. Kapilashrami ◽  
A. Jakobsson ◽  
S. Seetharaman ◽  
A. K. Lahiri
Keyword(s):  
Liquid Iron ◽  
Sessile Drop ◽  
Sessile Drop Technique ◽  
X Ray ◽  
Drop Technique

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

scholarly journals Wetting ofAl2O3by Molten Aluminum: The Influence ofBaSO4Additions

2008 ◽  
Vol 2008 ◽  
pp. 1-12 ◽  
Author(s):  
Joaquin Aguilar-Santillan
Keyword(s):  
High Temperatures ◽  
Firing Temperature ◽  
Molten Aluminum ◽  
Sessile Drop ◽  
Contact Angles ◽  
Sessile Drop Technique ◽  
Pure Alumina ◽  
Two Temperatures ◽  
Drop Technique

The effects ofBaSO4additions on the wetting of alumina by molten aluminum were studied by the sessile drop technique. To study the effect ofBaSO4decomposition(1100–1150∘C), the additions were treated at two temperatures700∘C(973 K) and1450∘C(1723 K), respectively.BaSO4additions at low and high temperatures did not improve the nonwetting character of these compositions. However, at higher firing temperature, the formation ofBA6 (BaO•6Al2O3)has a nonwetting trend with increasing its content. To address theBA6specifically a pureBaO•6Al2O3was produced and tested. It was more nonwetting than the pure alumina. After the analysis of the contact angles for theBaSO4and theBA6 (BaO•6Al2O3), it was concluded that these additions to alumina do not inhibit wetting by molten aluminum. In fact, at the addition levels common for refractories, the wetting tendency of molten aluminum is enhanced. Alternative explanations for the effectiveness ofBaSO4additions to alumina refractories are discussed.

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder
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