High Strain-Rate Compressive Behavior and Constitutive Modeling of Selected Polymers Using Modified Ramberg-Osgood Equation

2014 ◽  
Vol 566 ◽  
pp. 80-85
Author(s):  
Kenji Nakai ◽  
Takashi Yokoyama

The present paper is concerned with constitutive modeling of the compressive stress-strain behavior of selected polymers at strain rates from 10-3 to 103/s using a modified Ramberg-Osgood equation. High strain-rate compressive stress-strain curves up to strains of nearly 0.08 for four different commercially available extruded polymers were determined on the standard split Hopkinson pressure bar (SHPB). The low and intermediate strain-rate compressive stress-strain relations were measured in an Instron testing machine. Six parameters in the modified Ramberg-Osgood equation were determined by fitting to the experimental stress-strain data using a least-squares fit. It was shown that the monotonic compressive stress-strain behavior over a wide range of strain rates can successfully be described by the modified Ramberg-Osgood constitutive model. The limitations of the model were discussed.

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
Ken Blecker

Abstract Electronic parts may often get exposed to high strains during shocks, vibrations and drop conditions in both commercial and defense applications. In addition, such electronic parts can often be simultaneously exposed to extreme surrounding temperatures between −65°C and 200°C after storage in non-climate-controlled conditions. Electronic equipment can be subjected to strain rates of 1 to 100 per second in shock and vibration. Many of the doped SAC soldering alloys in the electronic components, including SAC-Q, SAC-R, Innolot have found applications in long-term thermal exposure environments. Low temperature high strain-rate properties are needed to assure durability under high temperature storage followed by shock and vibration. There is scarcity of high strain-rate data on alloys exposed to high temperature aging operating at extreme low-temperatures and extremely-high temperatures. For this study, SAC-Q material was tested and analyzed at temperatures from −65°C to 200°C and at a strain rates of from 10 to 75 per second. Following the production and retrieval of the specimens, specimens were stored for isothermal aging for up to 6 months at 100°C temperature, before performing tensile test experiments at various operating temperatures. Stress vs strain curves are formed for the wide range of strain rates and surrounding temperatures. In addition, test results and data were complemented by the Anand viscoplasticity model and by calculating stress-strain behavior, evaluated in a wide range of working temperatures and strains rates.


2011 ◽  
Vol 83 ◽  
pp. 130-135 ◽  
Author(s):  
Takashi Yokoyama ◽  
Kenji Nakai ◽  
Norfazrina Hayati Mohd Yatim

The high strain-rate compressive stress-strain loops for bulk specimens of an epoxy structural adhesive are determined on the standard split Hopkinson pressure bar. The compressive stress-strain data including unloading curves are obtained over a wide range of strain rates from 10-3to 103/s. The effects of strain rate on the initial (secant) modulus, flow stress, dissipation energy and hysteresis loss ratio are discussed. The experimental results show that the bulk structural adhesive exhibits dynamic viscoelastic behavior like polymers.


Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
Ken Blecker

Abstract In many industries, such as automotive, oil and gas, aerospace, medical technologies, electronic parts can often be exposed to high strain loads during shocks, vibrations and drop-impact conditions. Such electronic parts can often be subjected to extreme low and high temperatures ranging from −65°C to 200°C. Also, these electronic devices can be subjected to strain rates of 1 to 100 per second in the critical environment. Recently, many doped SAC solder alloys are being introduced in the electronic component including SAC-Q, SAC-R, Innolot. SAC-Q is made with addition of Bi in Sn-Ag-Cu composition. Mechanical characteristic results and data for lead-free solder alloys are extremely important for optimizing electronic package reliability, at high temperature storage and elevated strain rates. Furthermore, the mechanical properties of solder alloys can be changed significantly due to a thermal aging, which is causing modification of microstructure. Data for the SAC-Q solder alloy with a high temp aging and testing at extreme low to high operating temperatures are not available. SAC-Q material was tested and analyzed for this study at range of operating temperatures of −65°C to 200°C and at a strain rate up to 75 per second. After the specimens were manufactured and reflowed, specimens were stored at 100°C for the isothermal aging for up to 90 days, before tensile tests were carried out at different operating temperatures. For the wide range of strain rates and test temperatures, stress-strain curves are established. In addition, the measured experimental results and data were fitted to the Anand viscoplasticity model and the Anand constants were calculated by estimating the stress-strain behavior measured in the wide range of operating temperatures and strain rates.


2011 ◽  
Vol 686 ◽  
pp. 162-167 ◽  
Author(s):  
Zheng Liu ◽  
Ping Li Mao ◽  
Chang Yi Wang

The high strain rate compression behavior of extruded Mg-Gd-Y magnesium alloy was tested by split Hopkinson pressure bar (SHPB) under the strain rates of 465s-1,2140s-1and 3767s-1. As comparison the quasi-static compression behavior was tested in the meanwhile. The results show that the quasi-static yield stress is equivalent to that of high strain rates, but the flow stress at high strain rates are higher than that of quasi-static stain rate at the same strain. When the strain rate is increase from quasi-static to high strain rates the deformation stresses increase obviously but within the present testing high strain rates, increasing the strain rate the stress has a slight increasing, indicating that at high strain rate the stress of Mg-Gd-Y magnesium alloy is not sensitive to the strain rate. The constitutive equation between deformation stress, strain and strain rate was build based on the tested compression stress strain curves. The calculated stress strain data were compared with tested stress strain curves. The results demonstrate that when the strain rates are 0.001s-1,465s-1,2140s-1respectively the calculated and experimental data are fit very well. The calculated stress is higher than that of tested stress if the strain rate is increase to 3767s-1and the strain is more than 0.15. The discrepancy was explained through the physical soundness of Johnson-Cook model.


Author(s):  
Trunal Bhujangrao

The existing experimental tests are mainly designed to study the mechanical response of materials at various strain rates. Many researchers performed the experimental test in tension, compression, and shear (with torsion test) over a wide range of strain rates. They found out that material exhibits an increase in yield stress as well as flows stress with an increase in strain rate. It illustrates that there is a need for experimental data to study the material behaviour over the full range of strain rates, from quasi-static to high strain rate test. Many special techniques have been developed to bridge the strain rate gap between quasi-static and high strain rate testing to provide a method for an intermediate strain rate test for engineering materials. Some researchers have tried to conduct intermediate strain rate tests with standard servo-hydraulic load frames. However, the results of such tests are not accurate. The problem is that during the experiment, the whole machine is not in static equilibrium. The inertial effect influences the experimental data. The records obtained from these machines are often noisy with large oscillation. therefore, the comprehensive review is given to describes the development and evolution of the existing intermediate strain rate testing devices which includes the working principles, some critical theories, technological innovation in load measurement techniques, components of the device, basic technical assumption, and measuring techniques. In addition, some research direction on future implementation and development of an intermediate strain rate apparatus is also discussed in detail.


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