Physical and Mechanical Behaviors of SnCu-Based Lead-Free Solder Alloys with an Addition of Aluminium
2015 ◽
Vol 815
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pp. 64-68
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Keyword(s):
The effect of Al addition on the microstructure, melting point and microhardness of SnCu-Al lead-free solder alloys were investigated with two different compositions of Al which were 1 wt% and 5 wt%. These solder alloys were fabricated through powder metallurgy (PM) method. The results showed that the melting point and the microhardness value of the SnCu-Al lead-free solder alloy were increased as the Al content increased from 1 wt% to 5 wt%. The grain growth of SnCu-Al lead-free solder alloy also tends to be retarded due to the homogenous distribution of Al at the grain boundaries.
Keyword(s):
2005 ◽
Vol 475-479
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pp. 1747-1750
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Keyword(s):
2020 ◽
Vol 43
(12)
◽
pp. 2883-2891
Keyword(s):
2006 ◽
Vol 41
(12)
◽
pp. 1210-1213
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2018 ◽
Vol 71
(11)
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pp. 2855-2859
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Keyword(s):
2019 ◽
Vol 6
(12)
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pp. 126562
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Keyword(s):
Keyword(s):
2020 ◽
Vol ahead-of-print
(ahead-of-print)
◽
Keyword(s):