Study on Processing Properties of Epoxy Resin System in VARI

As a low cost moulding technology, VARI is widely used to produce advanced composite materials. At the same time, the particularity of VARI process make it have particular requirements on resin system. Epoxy resin system attracts extensive attention because of its good process performance. Curing reaction and rheological behavior of epoxy resin system were studied by DSC and viscosity experiments. The results showed that resin viscosity decreased from 2600 mPa•S at 15°C to 600mPa•S at 40°C . Viscosity of resin system rose about 0.5Pa•s within the first 2h. Gel time shortened dramatically when the temperature exceed 60°C. the curing temperature is 60°C be based on DSC curve and gel time-temperature curve. Resin cast plate of epoxy resin system has good mechanical properties of compression strength.

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Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems

Diyala Journal of Engineering Sciences ◽

10.24237/djes.2018.11107 ◽

2018 ◽

Vol 11 (1) ◽

Author(s):

Salah N. Farhan ◽

Muataz H. Ismael ◽

Ayad Dari Jaafar

Keyword(s):

Epoxy Resin ◽

Rheological Behavior ◽

Reaction Rates ◽

Curing Temperature ◽

Curing Agent ◽

Resin System ◽

Gel Time ◽

Epoxy Resin System

A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature.

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Design and development of low-cost optical-fiber sensors for temperature metrology: Process monitoring of an epoxy resin system

Journal of Applied Polymer Science ◽

10.1002/app.20745 ◽

2004 ◽

Vol 94 (1) ◽

pp. 83-95 ◽

Cited By ~ 3

Author(s):

B. Degamber ◽

J. Tetlow ◽

G. F. Fernando

Keyword(s):

Optical Fiber ◽

Epoxy Resin ◽

Process Monitoring ◽

Low Cost ◽

Optical Fiber Sensors ◽

Resin System ◽

Design And Development ◽

Fiber Sensors ◽

Epoxy Resin System ◽

Temperature Metrology

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The Study on Curing Kinetics of Lignin Based Epoxy Resin System Using Non-Isothermal DSC Method

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.788.223 ◽

2013 ◽

Vol 788 ◽

pp. 223-227 ◽

Cited By ~ 1

Author(s):

Ming Qiang Chen ◽

Shao Min Liu ◽

Feng Li ◽

Zhong Lian Yang ◽

Ye Zhang

Keyword(s):

Epoxy Resin ◽

Kinetic Parameters ◽

Raw Materials ◽

Curing Kinetics ◽

Reaction Model ◽

Curing Temperature ◽

Resin System ◽

Curing Reaction ◽

Epoxy Resin System ◽

Dsc Method

The synthesis of Lignin Base Epoxy Resin was based on industrial alkali lignin, and lignin-based epoxy resin curing characteristics were analyzed using the thermal weight loss technology under the oxygen atmosphere conditions. In light of the infra-red analysis of raw materials, the curing reaction kinetic parameters of lignin-based epoxy resin system were calculated using the Kissinger-Crane and Flynn-Wall-Ozawa method, and the curing reaction kinetics model of lignin-based epoxy resin system was established. The results showed that the kinetic parameters obtained using two methods were approximate, which validated that the curing reaction was consistent with the principle of the first-order reaction model. Initial curing temperature Ti0=454.88 K, curing temperature Tp0=507.55 K, and terminal temperature Tf0=598.77 K of lignin-based epoxy resin system were obtained when the extrapolation method was applied.

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