Investigation of Boron Nitride Prepared by Low Pressure Chemical Vapor Deposition at 650~1200 °C

2013 ◽  
Vol 537 ◽  
pp. 58-62 ◽  
Author(s):  
Fang Ye ◽  
Li Tong Zhang ◽  
Yong Sheng Liu ◽  
Meng Su ◽  
Lai Fei Cheng ◽  
...  

Boron nitride (BN) coatings were deposited on carbon substrates by low pressure chemical vapor deposition (LPCVD) in a large temperature range of 650~1200 °C, employing BCl3-NH3-H2 reaction system. The effects of depositing temperature on the yield, control step of deposition progress (deposition mechanism), microstructure, and crystallization degree of BN coating were investigated. Results show that BN deposition rate first increases and then decreases as the rising temperature and the maximum deposition rate occurs at 900~1000 °C. By the determination of the Arrenius relationship, there are three temperature regions with different active energies and controlled by different deposition mechanisms, i.e. chemical reaction, mass transport and depletion of reactants. Through the surface morphology observation by scanning electron microscopy (SEM), chemical composition analyses by energy dispersion spectroscopy (EDS) and crystallization degree and grain size comparison by Raman spectroscopy, it can be drawn that interphase-used BN is suitable to be deposited at 1000 °C.

2016 ◽  
Vol 652 ◽  
pp. 27-31 ◽  
Author(s):  
Liangjie Wang ◽  
Taotao Li ◽  
Lin Ling ◽  
Jie Luo ◽  
Kai Zhang ◽  
...  

2006 ◽  
Vol 527-529 ◽  
pp. 311-314 ◽  
Author(s):  
Xiao An Fu ◽  
Jacob Trevino ◽  
Mehran Mehregany ◽  
Christian A. Zorman

This paper reports the effect of deposition temperature on the deposition rate, residual stress, and resistivity of in-situ nitrogen-doped (N-doped) polycrystalline 3C-SiC (poly-SiC) films deposited by low pressure chemical vapor deposition (LPCVD). N-doped poly-SiC films were deposited in a high-throughput, resistively-heated, horizontal LPCVD furnace capable of holding up to 150 mm-diameter substrates using SiH2Cl2 (100%) and C2H2 (5% in H2) precursors, with NH3 (5% in H2) as the doping gas. The deposition rate increased, while the residual stress decreased significantly as the deposition temperature increased from 825oC to 900°C. The resistivity of the films decreased significantly from 825°C to 850°C. Above 850°C, although the resistivity still decreased, the change was much smaller than at lower temperatures. XRD patterns indicated a polycrystalline (111) 3C-SiC texture for all films deposited in the temperature range studied. SIMS depth profiles indicated a constant nitrogen atom concentration of 2.6×1020/cm3 in the intentionally doped films deposited at 900°C. The nitrogen concentration of unintentionally doped films (i.e., when NH3 gas flow was zero) deposited at 900°C was on the order of 1017/cm3. The doped films deposited at 900°C exhibited a resistivity of 0.02 -cm and a tensile residual stress of 59 MPa, making them very suitable for use as a mechanical material supporting microelectromechanical systems (MEMS) device development.


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