Effect of Hydrogenation Temperature on Distribution of Hydrogen Atoms in c-Si and a-Si: Molecular Dynamic Simulations

2016 ◽  
Vol 706 ◽  
pp. 55-59 ◽  
Author(s):  
Mauludi Ariesto Pamungkas ◽  
Rendra Widiyatmoko

Crystalline silicon and amorphous silicon are main materials of solar cell. Under prolonged exposure to light, silicon will degrade in quality. Hydrogenation is believed can minimize this degradation by reduce the number of dangling bond. These Molecular dynamics simulations are aimed to elaborate the hydrogenation process of crystalline silicon and amorphous silicon and to elucidate effect of temperature on distribution of hydrogen atoms. Reactive Force Field is selected owing to its capability to describe forming and breaking of atomic bonds as well as charge transfer. Hydrogenation is performed at 300 K, 600 K, 900 K, and 1200 K. Hydrogenated silicon surface hinders further hydrogen atoms to be absorbed such that not all deposited Hydrogen atoms are absorbed by silicon surface. Generally, the higher hydrogenation temperature the more hydrogen atoms are absorbed. Increment of temperature from 900 K to 1200 K only enhances a few numbers of absorbed hydrogen atoms. However, it can enable hydrogen atoms to penetrate into deeper silicon substrate. It is also observed that hydrogen atoms can penetrate into amorphous silicon deeper than into crystalline silicon.

2011 ◽  
Vol 99 (20) ◽  
pp. 203503 ◽  
Author(s):  
Jan-Willem A. Schüttauf ◽  
Karine H. M. van der Werf ◽  
Inge M. Kielen ◽  
Wilfried G. J. H. M. van Sark ◽  
Jatindra K. Rath ◽  
...  

2009 ◽  
Vol 76-78 ◽  
pp. 387-391 ◽  
Author(s):  
Kausala Mylvaganam ◽  
Liang Chi Zhang

This paper explores the effect of the depth-of-cut of an indenter on the phase transformations during nanoscratching on monocrystalline silicon on the Si(100) orientation. The analysis was carried out by molecular dynamics simulations. It was found that the depth-of-cut and the impingement direction of the indenter had a significant influence on the phase transformations in the initial impression region. At a relatively low depth-of-cut, only amorphous silicon was formed on the scratched surface. When the indenter impinged on a silicon surface with an angle, a bct5-Si crystalline phase in the initial impression region would emerge.


2014 ◽  
Vol 9 (1) ◽  
pp. 53-56 ◽  
Author(s):  
H. Meddeb ◽  
Twan Bearda ◽  
Wissem Dimassi ◽  
Yaser Abdulraheem ◽  
Hatem Ezzaouia ◽  
...  

2011 ◽  
Vol 98 (15) ◽  
pp. 153514 ◽  
Author(s):  
Jan-Willem A. Schüttauf ◽  
Karine H. M. van der Werf ◽  
Inge M. Kielen ◽  
Wilfried G. J. H. M. van Sark ◽  
Jatindra K. Rath ◽  
...  

RSC Advances ◽  
2017 ◽  
Vol 7 (3) ◽  
pp. 1357-1362 ◽  
Author(s):  
Jing Han ◽  
Song Xu ◽  
Jiapeng Sun ◽  
Liang Fang ◽  
Hua Zhu

Large-scale molecular dynamics simulations of nanoindentation on a (100) oriented silicon surface were performed to investigate the mechanical behavior and phase transformation of single crystalline silicon.


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