Coconut Shell Powder and Electrical Tree Inhibition of Solid Insulator

2018 ◽  
Vol 775 ◽  
pp. 89-93 ◽  
Author(s):  
Thanyakon Saithanu ◽  
Amnart Suksri

Electrical tree phenomenon commonly occurred in solid insulator material resulting from the inconsistency of stresses during the manufacturing process. The treeing phenomenon will degrade the characteristic of insulator and may lead to breakdown. The use of filler in the manufacturing process in order to enhancing the insulation property is a popular approach. This paper presents the use of coconut shell powder (CSP) filler in epoxy resin for inhibition of electrical tree growth. The particle sizes of CSP varied from 62, 75 and 125 µm. The CSP is filled with the ratio of 0.1, 0.2, 0.4, 0.6, 0.8, 1.0, 2.0 and 3.0% by weight. We aim to observe the effects of varying the combination of CSP particle sizes and the ratio of epoxy resin for an inhibition of electrical tree growth. The electrical tree was tested by applying AC voltage of 15kV to the test sample and conducted for 360 minutes in this experiment. When the epoxy resin using CSP filler of 1% by weight is fixed for the particle size of 62, 75 and 125 µm, electrical tree length is at 1.24mm, 1.382 mm and 1.78 mm respectively. Whereas, when the particle size of CSP at 62 µm is fixed, a tree length is 1.98 mm and 1.24 mm for the ratio of 0.1 and 1% by weight respectively. Our study demonstrates that the epoxy resin using CSP filler at a ratio of 0.1% by weight can shorten length of electrical tree when compared with a ratio of 1.0% by weight. The electrical tree length was affected through the changes of permittivity by addition of CSP compound.

2016 ◽  
Vol 718 ◽  
pp. 36-39 ◽  
Author(s):  
Thanyakon Saithanu ◽  
Amnart Suksri

Electrical tree phenomenon is a long term degradation and can be found in solid insulator material. Its phenomenon will degrade the characteristic of insulator and may lead to breakdown. The use of filler in the process of manufacturing for the insulation is very popular method. This paper presents the use of coconut shell powder (CSP) filler in epoxy resin for inhibition of electrical tree growth. The CSP is filled with in ratio of 0.1, 0.3, 0.5, 0.8 and 1.0% by weight. The electrical tree was tested by AC voltage of 15kV and conducted for 30 minutes in this experiment. Experimental results shown that, the pure epoxy resin using as a controlled has tree length of 3.20 mm. While the epoxy resin using CSP filler of 1% by weight has a tree length propagation of 2.10 mm. The shorten length of electrical tree may be affected by the combination of modified permittivity (Ɛ) value of an insulator. Also, this study has shown that the CSP may be a potential candidate as a filler compound to be used as electrical tree inhibition for electrical insulation system.


Sensors ◽  
2021 ◽  
Vol 21 (7) ◽  
pp. 2562
Author(s):  
Abdullahi Abubakar Mas’ud ◽  
Arunachalam Sundaram ◽  
Jorge Alfredo Ardila-Rey ◽  
Roger Schurch ◽  
Firdaus Muhammad-Sukki ◽  
...  

In high-voltage (HV) insulation, electrical trees are an important degradation phenomenon strongly linked to partial discharge (PD) activity. Their initiation and development have attracted the attention of the research community and better understanding and characterization of the phenomenon are needed. They are very damaging and develop through the insulation material forming a discharge conduction path. Therefore, it is important to adequately measure and characterize tree growth before it can lead to complete failure of the system. In this paper, the Gaussian mixture model (GMM) has been applied to cluster and classify the different growth stages of electrical trees in epoxy resin insulation. First, tree growth experiments were conducted, and PD data captured from the initial to breakdown stage of the tree growth in epoxy resin insulation. Second, the GMM was applied to categorize the different electrical tree stages into clusters. The results show that PD dynamics vary with different stress voltages and tree growth stages. The electrical tree patterns with shorter breakdown times had identical clusters throughout the degradation stages. The breakdown time can be a key factor in determining the degradation levels of PD patterns emanating from trees in epoxy resin. This is important in order to determine the severity of electrical treeing degradation, and, therefore, to perform efficient asset management. The novelty of the work presented in this paper is that for the first time the GMM has been applied for electrical tree growth classification and the optimal values for the hyperparameters, i.e., the number of clusters and the appropriate covariance structure, have been determined for the different electrical tree clusters.


2020 ◽  
Vol 27 (3) ◽  
pp. 820-828
Author(s):  
Siyuan Chen ◽  
Zepeng Lv ◽  
James Carr ◽  
Malte Storm ◽  
Simon M. Rowland

2018 ◽  
Vol 25 (6) ◽  
pp. 2183-2190 ◽  
Author(s):  
Ibrahim Iddrissu ◽  
Simon M Rowland ◽  
Hualong Zheng ◽  
Zepeng Lv ◽  
Roger Schurch

IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 47273-47281 ◽  
Author(s):  
Boxue Du ◽  
Meng Tian ◽  
Jingang Su ◽  
Tao Han

2021 ◽  
Vol 10 (2) ◽  
pp. 48-52
Author(s):  
Cut Rizka Maulida ◽  
Mursal Mursal ◽  
Ismail Ismail

Abstrak. Penelitian ini bertujuan untuk membuat papan partikel dengan menggunakan limbah ampas kopi dan resin epoksi sebagai perekat. Komposisi resin epoksi divariasikan yaitu 5, 10, 15 dan 20 vol.% untuk masing-masing partikel ampas kopi berukuran 20 dan 40 mesh. Papan partikel dibuat dengan teknik pressing dengan beban sebesar 9 ton selama 30 menit. Sifat mekanik yang diuji adalah MOE, MOR, dan kuat tekan. Sifat fisis papan partikel yang diuji adalah kerapatan dan pengembangan tebal. Hasil menunjukkan bahwa nilai MOE tertinggi yaitu 20,910 kgf/cm2 pada komposisi 95 vol.% ampas kopi dan 5 vol.% resin epoksi dengan ukuran ampas kopi 40 mesh. MOR tertinggi yaitu 167 kgf/cm2 pada ukuran partikel 40 mesh dengan komposisi ampas kopi 90 vol.% dan resin epoksi 10 vol.%. Nilai kuat tekan tertinggi diperoleh 220 kgf/cm2 pada 20 mesh, dengan komposisi 85 vol.% ampas kopi dan 15 vol.% resin epoksi. Kerapatan dan pengembangan tebal papan partikel yang tertinggi masing-masing adalah 1,16 g/cm3 dan 0,85%. Secara umum, sifat mekanis papan partikel ampas kopi tergantung pada komposisi dan ukuran partikel ampas kopi. Namun, sifat fisisnya tidak berubah secara signifikan untuk ukuran partikel dan komposisi yang berbeda. Papan partikel yang diperoleh dari penelitian ini memenuhi standar ANSI sehingga berpotensi untuk dijadikan sebagai papan partikel atau komposit. Abstract.. This study aims to make a particle board using coffee ground waste and epoxy resin as an adhesive. The composition of the epoxy resin was varied, namely 5, 10, 15 and 20 vol.% for 20 mesh and 40 mesh of coffee grounds particles. Particle board is made by pressing technique with a load of 9 tons for 30 minutes. The mechanical properties tested were MOE, MOR, and compressive strength. The physical properties of the particle board tested were density and thickness swelling. The results showed that the highest MOE particle board was 20.910 kgf/cm2 (95 vol.% coffee grounds:5 vol.% epoxy resin; 40 mesh). The highest MOR was 167 kgf/cm2 (90 vol.% coffee grounds:10 vol.% epoxy resin;40 mesh). The hihgest compressive strength values was 220 kgf/cm2 (85 vol.% coffee grounds:15 vol.% epoxy resin;20 mesh). The highest density and thickness expansion were 1.16 g/cm3 and 0.85%, respectively. In general, the mechanical properties of coffee grounds particleboard depend on the composition and particle size of coffee grounds. However, their physical properties do not change significantly for different particle sizes and compositions. The particle board obtained from this study meets the standard of ANSI. Thus, coffee grounds have the potential to be used as particle board or composite. Keywords particle board, coffee grounds, epoxy resin, mechanical properties, physical properties


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