Thermal Stress Simulation in TiB2-Cu Functionally Graded Materials

2003 ◽  
Vol 423-425 ◽  
pp. 245-248
Author(s):  
Xue Bing Wang ◽  
Xing Hong Zhang ◽  
Shan Yi Du
Keyword(s):  
Thermal Stress ◽  
Functionally Graded Materials ◽  
Functionally Graded ◽  
Graded Materials ◽  
Stress Simulation

Thermoelastic Deformations of Functionally Graded Materials Plates

2013 ◽  
Vol 740 ◽  
pp. 570-573
Author(s):  
Ming Lu Wang
Keyword(s):  
Thermal Stress ◽  
Rectangular Plate ◽  
Thin Plate ◽  
Functionally Graded Materials ◽  
Governing Equation ◽  
Functionally Graded ◽  
Thin Plates ◽  
Graded Materials ◽  
Navier Solution ◽  
Simply Supported

The governing equation of thermoelastic FGM thin plates was obtained by degenerating the governing equation of thermoviscoelastic FGM thin plates. A Navier solution of a simply supported FGM rectangular plate under thermal loads was get. Based on the Navier solution, the influence of considering and ignoring mid-plane stain, due to the inhomogeneous property of the functionally graded materials, on the maximal deflection and thermal stress of the functionally graded materials thin plate is investigated.

Approach to Optimum Layer Structure of Functionally Graded Materials

2009 ◽  
Vol 631-632 ◽  
pp. 29-34
Author(s):  
Kazuhiro Hasezaki ◽  
Yasutoshi Noda
Keyword(s):  
Thermal Expansion ◽  
Thermal Stress ◽  
Fly Ash ◽  
Thermal Expansion Coefficient ◽  
Functionally Graded Materials ◽  
Layer Structure ◽  
Functionally Graded ◽  
Graded Materials ◽  
Interface Cracking ◽  
The Empirical Analysis

Minimum interlayer numbers of functionally graded materials (FGMs) are studied based on the empirical analysis of thermal stress due to the differences in the thermal expansion coefficient  and temperature T between sintering and room temperatures. It is found the maximum ,   and the minimum interlayer number necessary to produce a NiCr / Fly ash FGM structure without interface cracking were 4.0×10-6 K-1, 1080 K, 0.043 and 2, respectively. The condition  < 0.043 was derived and confirmed to be valid for available FGM systems.

THERMAL STRESSES FOR FUNCTIONALLY GRADED MATERIALS (FGMS) SUBJECT TO HEAT FLUX

2021 ◽  
Author(s):  
NILABH KRISHNA ◽  
SEIICHI NOMURA
Keyword(s):  
Heat Flux ◽  
Thermal Stress ◽  
Functionally Graded Materials ◽  
Thermal Stresses ◽  
Spherical Inclusion ◽  
Homogeneous Medium ◽  
Functionally Graded ◽  
Far Field ◽  
Graded Materials ◽  
Weighted Residuals

In this paper, the thermal stress due to heat flux at the far field is derived for an infinitely extended elastic medium which contains a spherical inclusion made of functionally graded materials (FGMs). The 3-D heat conduction equation subject to uniform heat flux at the far field is solved analytically to derive the temperature distribution. Based on the temperature solution, the thermal stress field due to heat flux is obtained by solving a set of two ordinary differential equations using the method of weighted residuals. Unlike the two-phase homogeneous medium, the von Mises stress distribution is continuous at the interface of the FGM-matrix medium.

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