The Effect of the Doping Profile in Aluminum Back-Surface-Field on the Electronic Properties of c-Si Solar Cells

2010 ◽  
Vol 654-656 ◽  
pp. 1690-1693
Author(s):  
Ji Cheng Zhou ◽  
Yong Min Chen

The electronic properties of the solar cells were greatly influenced by the aluminum atomic concentration in Al-BSF region under that the Al-BSF is doped heavily. The effects of the dopincg profile in heavily-doped Al-BSF on electronic properties of n+pp+ monocrystalline solar cells were investigated by PC1D. The results show that the electronic properties of solar cells are almost independent of the doping profile of the Al-BSF, but are more or less affected by the BSF profile if the solar cell back surface is passivated well with the BSRV less than ~105cm/s. When the sheet resistance is about between 5 and 30Ω/□, the conversion efficiency can reach the maximum value. And the optimum thickness of Al-BSF is about between 10~15μm.

2017 ◽  
Vol 2017 ◽  
pp. 1-7
Author(s):  
Wenchang Yeh ◽  
Hikaru Moriyama

Sputter epitaxy of p+ layer for fabrication of Si solar cells (SCs) was demonstrated. Hall carrier concentration of p+ layer was 2.6 × 1020 cm−3 owing to cosputtering of B with Si at low temperature, which had enabled heavy and shallow p+ dope layer. p+nn+ SCs were fabricated and influence of p+ and n+ layers was investigated. Internal quantum efficiency (IQE) of p+nn+ SCs was 95% at visible light and was larger than 60% at ultraviolet (UV) light when the p+ layer was thinner than 30 nm. At near infrared (NIR), extra increment on IQE was achieved by rear n+ back surface field (BSF) layer with a thickness thinner than 100 nm.


Solar Energy ◽  
2021 ◽  
Vol 220 ◽  
pp. 211-216
Author(s):  
H.P. Yin ◽  
W.S. Tang ◽  
J.B. Zhang ◽  
W. Shan ◽  
X.M. Huang ◽  
...  

2018 ◽  
Vol 74 ◽  
pp. 309-312 ◽  
Author(s):  
Xueliang Yang ◽  
Bingbing Chen ◽  
Jianhui Chen ◽  
Yi Zhang ◽  
Wei Liu ◽  
...  

2009 ◽  
Vol 1210 ◽  
Author(s):  
Vishal Mehta ◽  
Bhushan Sopori ◽  
Robert Reedy ◽  
Bobby To ◽  
Helio Moutinho ◽  
...  

AbstractThis paper identifies some mechanisms that lead to problems in back Al contact formation. Major issues are related to a basic problem that the Al melt has a large surface tension and tries to ball up during the firing step. Other issues arise from dissolution of the Si-Al interface and entrapment of glass within the Si-Al alloy. Si diffusion into Al can be applied to control the melt, while cooling rate can help improve the structure of various regions of the back contact for a favorable series resistance. We also discuss a modified time-temperature profile that can lead to a deep and uniform back-surface field.


RSC Advances ◽  
2014 ◽  
Vol 4 (9) ◽  
pp. 4225-4229 ◽  
Author(s):  
Gajendra Singh ◽  
Amit Verma ◽  
R. Jeyakumar

2015 ◽  
Vol 44 (4) ◽  
pp. 1181-1186 ◽  
Author(s):  
Nagarajan Balaji ◽  
Cheolmin Park ◽  
Minkyu Ju ◽  
Seunghwan Lee ◽  
Jungmo Kim ◽  
...  

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