The Effect of Substrate Deformation in UV-Nanoimprint Lithography Using a Large Area Stamp
2007 ◽
Vol 121-123
◽
pp. 649-652
Keyword(s):
We investigated the non-uniformity of the residual layer thickness caused by wafer deformation in an experiment that examined different wafer thicknesses using UV-NIL with an element-wise patterned stamp (EPS). Experiments using the EPS were performed on an EVG®620-NIL. Severe deformation of the wafer served as an obstacle to the spread of resin drops, which caused non-uniformity of the residual layer thickness. We also simulated the imprint process using a simplified model and finite element method to analyze the non-uniformity.
2019 ◽
Vol 242
◽
pp. 062032
Keyword(s):
2017 ◽
Vol 754
◽
pp. 206-209
◽
2021 ◽
Vol ahead-of-print
(ahead-of-print)
◽
Keyword(s):
2014 ◽
Vol 11
(8)
◽
pp. 1750-1755
◽
Keyword(s):
2008 ◽
Vol 45
(3)
◽
pp. 207-218
◽
Keyword(s):
2021 ◽