Particle Removal Mechanism of Hydrogenated Ultrapure Water with Megasonic Irradiation

2001 ◽  
Vol 76-77 ◽  
pp. 245-250 ◽  
Author(s):  
Hiroshi Morita ◽  
Jun ichi Ida ◽  
Osamu Ota ◽  
Kazumi Tsukamoto ◽  
Tadahiro Ohmi
2019 ◽  
Vol 92 (2) ◽  
pp. 199-207
Author(s):  
Yoshiyuki Seike ◽  
Ryoga Sawaki ◽  
Ryosuke Shimizu ◽  
Tomomi Hikida ◽  
Yuji Honda ◽  
...  

2012 ◽  
Vol 516 ◽  
pp. 84-89 ◽  
Author(s):  
Joon Ho An ◽  
Yeong Bong Park ◽  
Hae Do Jeong

Brush cleaning can trigger both mechanical and chemical reaction to efficiently remove the adsorbed particles on the wafer. However, the removal mechanism of nanosized particles by brush cleaning is far from clear because no direct experimental data, such as the friction and contact force of the interface between brush and wafer surface, are available to back up the theoretical models in the literature. In this paper, we set up a monitoring system to measure the friction force of the interface between brush and wafer surface during brush cleaning to investigate the effect of the brush nodule structure having different nodule heights and nodule gaps on particle removal efficiency. To confirm the mechanical effect of the brush nodule structure, an oxide wafer contaminated with Polystyrene latex (PSL) particles (mean diameter: 300 nm) was cleaned with each PVA brush having different brush nodule structures using de-ionized water (DIW). The silica particle (mean diameter: 22 nm) and chemical solution (NH4OH, 0.1 wt%) were also used to investigate the chemical-aided particle removal. The remaining particles were measured with a Surfscan 6420 (KLA Tencor) and the friction force monitoring was conducted by using a Cleaner812-L (G&P Technology). The results indicated that a higher brush nodule height produced lower friction force, resulting in lower particle removal efficiency. When the nodule gap became smaller, the contact area between brush nodule and wafer surface became larger, resulting in higher particle removal efficiency. However, the experimental results using silica particles and 0.1 wt% of NH4OH showed different trends under each condition. The particle removal mechanism with silica particle and NH4OH was also verified by measuring the zeta potential between the particle and wafer.


2019 ◽  
Vol 34 (2) ◽  
pp. 324-331 ◽  
Author(s):  
Jinguang Du ◽  
Wuyi Ming ◽  
Yang Cao ◽  
Jun Ma ◽  
Wenbin He ◽  
...  

2013 ◽  
Vol 373-375 ◽  
pp. 2038-2041 ◽  
Author(s):  
Xin Tao Zhi ◽  
Dao Hui Xiang ◽  
Jing Quan Deng

High volume fraction SiCp/Al is a new kind of composite materials, with broad application prospect in the aerospace, automobile manufacturing and other fields, and gradually become the key materials in the field of high technology. But with its internal high hardness material (SiC) content increases and the material removal mechanism is not very clear, general machining is more difficult and seriously hinders the development of the material. With the advantages of high material removal rate, effectively processing all kinds of complicated curved surface, especially, in the thin-walled parts processing, milling occupies an absolute advantage. In order to solve the processing problems of high volume fraction SiCp/Al composites, basing on the theory of ultrasonic and brittle material removal. PCD milling experiment of SiCp/Al was carried out with homemade ultrasonic milling system under the condition of ultrasonic vertical vibration, the material removal mechanism was studied, the 2d and 3d model of surface formation was established, finally, microscopic structure on the surface of the workpiece was analyzed by metallographic microscope and electron microscope. Research results show that: SiC particle removal form can be divided into type of cut, pulled, pressed and crack penetration; under the condition of ultrasonic, probability of SiC particles cut type increased, this forms better surface smoothness; due to tool and chip separation characteristics and the ultrasonic impact effect on material, the removal mechanism of SiCp/Al is close to the plastic material, forming better surface quality under condition of ultrasonic. This paper verifies that the ultrasonic vertical vibration cutting is an effective machining method for high volume fraction SiCp/Al.


2009 ◽  
Vol 145-146 ◽  
pp. 39-42 ◽  
Author(s):  
Michael T. Andreas ◽  
Kurt Wostyn ◽  
Masayuki Wada ◽  
Tom Janssens ◽  
Karine Kenis ◽  
...  

High velocity aerosol cleaning using ultrapure water or dilute aqueous solutions (e.g. dilute ammonia) is common in semiconductor IC fabrication [1]. This process combines droplet impact forces with continuous liquid flow for improved cleaning efficiency of sub-100nm particles. As with any physically enhanced cleaning process, improved particle removal can be accompanied by increased substrate damage, especially to smaller (<80nm) features [2]. Solvents such as N-methylpyrrolidone (NMP) and tetrahydrofurfuryl alcohol (THFA) are used for resist strip applications [3]. It is possible, and sometimes useful, to deliver these solvents through the same spray nozzle normally used for aqueous spray cleaning. In this presentation we explore the particle removal and substrate damage performance of 2-ethoxyethanol (EGEE), NMP and THFA as used in a conventional aerosol spray cleaning system


1984 ◽  
Vol 75 ◽  
pp. 599-602
Author(s):  
T.V. Johnson ◽  
G.E. Morfill ◽  
E. Grun

A number of lines of evidence suggest that the particles making up the E-ring are small, on the order of a few microns or less in size (Terrile and Tokunaga, 1980, BAAS; Pang et al., 1982 Saturn meeting; Tucson, AZ). This suggests that a variety of electromagnetic and plasma affects may be important in considering the history of such particles. We have shown (Morfill et al., 1982, J. Geophys. Res., in press) that plasma drags forces from the corotating plasma will rapidly evolve E-ring particle orbits to increasing distance from Saturn until a point is reached where radiation drag forces acting to decrease orbital radius balance this outward acceleration. This occurs at approximately Rhea's orbit, although the exact value is subject to many uncertainties. The time scale for plasma drag to move particles from Enceladus' orbit to the outer E-ring is ~104yr. A variety of effects also act to remove particles, primarily sputtering by both high energy charged particles (Cheng et al., 1982, J. Geophys. Res., in press) and corotating plasma (Morfill et al., 1982). The time scale for sputtering away one micron particles is also short, 102 - 10 yrs. Thus the detailed particle density profile in the E-ring is set by a competition between orbit evolution and particle removal. The high density region near Enceladus' orbit may result from the sputtering yeild of corotating ions being less than unity at this radius (e.g. Eviatar et al., 1982, Saturn meeting). In any case, an active source of E-ring material is required if the feature is not very ephemeral - Enceladus itself, with its geologically recent surface, appears still to be the best candidate for the ultimate source of E-ring material.


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