Simulation of Mold Filling for Non-Newtonian Fluids - Part 2
This paper deals with the flow in the resin transfer molding process commonly used for IC chip encapsulation in the electronic packaging industry. A solution algorithm is presented for modeling the flow of a non-Newtonian fluid obeying a Power-Law model and the algorithm is used to conduct parametric studies in transfer molding. The flow model uses the Hele-Shaw approximation to solve the Navier-Stokes Equations and a pseudo-concentration algorithm for tracking the interface between the resin and the air. The Finite Element Method is employed to reduce the governing partial differential equations to algebraic form. The model is used to study the flow from the transfer ram into the cavity for different dimensions of transfer molding tools. Parametric studies are carried out to obtain balanced filling for transfer molding configuration. Parametric studies could provide a design guideline to optimize the encapsulation process prior to the setting up of an actual manufacturing set.