Laser Sintering of Aerosol Jet Printed Interconnects on Flexible Substrate
2019 ◽
Vol 2019
(1)
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pp. 000404-000408
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Abstract Laser sintering of interconnects printed on flexible substrate with silver nanoparticle ink is studied as an alternative to convection oven sintering. Interconnects of 80 μm and 250 μm line width are printed using an aerosol jet printer and sintered using an 830 nm continuous wave laser. A conductivity that is 4.5× higher than that of an oven sintered interconnect is achieved at optimal laser power and sintering speed set using a full factorial statistical design.
2015 ◽
Vol 85
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pp. 904-909
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2003 ◽
Vol 325
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pp. 224-229
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