New Half Shaft Bench Test Methodology for NVH Characterization

2019 ◽  
Author(s):  
Saeed Siavoshani ◽  
Prasad Balkrishna Vesikar ◽  
Wei Yuan ◽  
Ahmad Abbas ◽  
Francisco Antonio Sturla
Keyword(s):  
2019 ◽  
Author(s):  
Hiral Haria ◽  
Yuji Fujii ◽  
Gregory M. Pietron ◽  
Anna Sun ◽  
Takahiro Tsuchiya ◽  
...  

2015 ◽  
Vol 192 (5) ◽  
pp. 642-642 ◽  
Author(s):  
Maryanne Z. Mariyaselvam ◽  
Matt P. Wise ◽  
David W. Williams

Author(s):  
Jenny Fan ◽  
Dave Mark

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.


1998 ◽  
Author(s):  
R. Berriche ◽  
R.K. Lowry ◽  
M.I. Rosenfield

Abstract The present work investigated the use of the Vickers micro-hardness test method to determine the resistance of individual die to cracking. The results are used as an indicator of resistance to failure under the thermal and mechanical stresses of packaging and subsequent thermal cycling. Indentation measurements on die back surfaces are used to determine how changes in wafer backside processing conditions affect cracks that form around impressions produced at different loads. Test methodology and results obtained at different processing conditions are discussed.


Author(s):  
Ray Talacka ◽  
Nandu Tendolkar ◽  
Cynthia Paquette

Abstract The use of memory arrays to drive yield enhancement has driven the development of many technologies. The uniformity of the arrays allows for easy testing and defect location. Unfortunately, the complexities of the logic circuitry are not represented well in the memory arrays. As technologies push to smaller geometries and the layout and timing of the logic circuitry become more problematic the ability to address yield issue is becoming critical. This paper presents the added yield enhancement capabilities of using e600 core Scan Chain and Scan Pattern testing for logic debug, ways to interpret the fail data, and test methodologies to balance test time and acquiring data. Selecting a specific test methodology and using today's advanced tools like Freescale's DFT/FA has been proven to find more yield issues, earlier, enabling quicker issue resolution.


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