Compact Camera Module Cover Defect Classification using Quadtree Decomposition based Deep Learning

2021 ◽  
Vol 27 (8) ◽  
pp. 626-632
Author(s):  
Min-Ho Ha ◽  
Tae-Hyoung Park
Author(s):  
Yang Liu ◽  
Yachao Yuan ◽  
Jing Liu

Abstract Automatic defect classification is vital to ensure product quality, especially for steel production. In the real world, the amount of collected samples with labels is limited due to high labor costs, and the gathered dataset is usually imbalanced, making accurate steel defect classification very challenging. In this paper, a novel deep learning model for imbalanced multi-label surface defect classification, named ImDeep, is proposed. It can be deployed easily in steel production lines to identify different defect types on the steel's surface. ImDeep incorporates three key techniques, i.e., Imbalanced Sampler, Fussy-FusionNet, and Transfer Learning. It improves the model's classification performance with multi-label and reduces the model's complexity over small datasets with low latency. The performance of different fusion strategies and three key techniques of ImDeep is verified. Simulation results prove that ImDeep accomplishes better performance than the state-of-the-art over the public dataset with varied sizes. Specifically, ImDeep achieves about 97% accuracy of steel surface defect classification over a small imbalanced dataset with a low latency, which improves about 10% compared with that of the state-of-the-art.


Author(s):  
Uzma Batool ◽  
Mohd Ibrahim Shapiai ◽  
Nordinah Ismail ◽  
Hilman Fauzi ◽  
Syahrizal Salleh

Silicon wafer defect data collected from fabrication facilities is intrinsically imbalanced because of the variable frequencies of defect types. Frequently occurring types will have more influence on the classification predictions if a model gets trained on such skewed data. A fair classifier for such imbalanced data requires a mechanism to deal with type imbalance in order to avoid biased results. This study has proposed a convolutional neural network for wafer map defect classification, employing oversampling as an imbalance addressing technique. To have an equal participation of all classes in the classifier’s training, data augmentation has been employed, generating more samples in minor classes. The proposed deep learning method has been evaluated on a real wafer map defect dataset and its classification results on the test set returned a 97.91% accuracy. The results were compared with another deep learning based auto-encoder model demonstrating the proposed method, a potential approach for silicon wafer defect classification that needs to be investigated further for its robustness.


2020 ◽  
Vol 39 (3) ◽  
Author(s):  
Chiraz Ajmi ◽  
Juan Zapata ◽  
José Javier Martínez-Álvarez ◽  
Ginés Doménech ◽  
Ramón Ruiz

2020 ◽  
Vol 33 (10-11) ◽  
pp. 1105-1117
Author(s):  
Sze-Teng Liong ◽  
Danna Zheng ◽  
Yen-Chang Huang ◽  
Y. S. Gan

2020 ◽  
Vol 10 (5) ◽  
pp. 1878 ◽  
Author(s):  
Wenhui Hou ◽  
Dashan Zhang ◽  
Ye Wei ◽  
Jie Guo ◽  
Xiaolong Zhang

The weld defects inspection from radiography films is critical for assuring the serviceability and safety of weld joints. The various limitations of human interpretation made the development of innovative computer-aided techniques for automatic detection from radiography images an interest point of recent studies. The studies of automatic defect inspection are synthetically concluded from three aspects: pre-processing, defect segmentation and defect classification. The achievement and limitations of traditional defect classification method based on the feature extraction, selection and classifier are summarized. Then the applications of novel models based on learning(especially deep learning) were introduced. Finally, the achievement of automation methods were discussed and the challenges of current technology are presented for future research for both weld quality management and computer science researchers.


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