scholarly journals TFT-LCD Driver IC Design

10.5772/9681 ◽  
2009 ◽  
Author(s):  
Chih-Wen Lu
Keyword(s):  
Ic Design ◽  
Lcd Driver

Application of Fast Laser Deprocessing Techniques in Physical Failure Analysis on SRAM Memory of Advance Technology

2014 ◽  
Author(s):  
H.H. Yap ◽  
P.K. Tan ◽  
G.R. Low ◽  
M.K. Dawood ◽  
H. Feng ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Integrated Circuit ◽  
Cost Effective ◽  
Tetraethyl Orthosilicate ◽  
Ic Design ◽  
Advance Technology ◽  
Defect Identification ◽  
Technology Scaling ◽  
And Function ◽  
Metal Layers

Abstract With technology scaling of semiconductor devices and further growth of the integrated circuit (IC) design and function complexity, it is necessary to increase the number of transistors in IC’s chip, layer stacks, and process steps. The last few metal layers of Back End Of Line (BEOL) are usually very thick metal lines (>4μm thickness) and protected with hard Silicon Dioxide (SiO2) material that is formed from (TetraEthyl OrthoSilicate) TEOS as Inter-Metal Dielectric (IMD). In order to perform physical failure analysis (PFA) on the logic or memory, the top thick metal layers must be removed. It is time-consuming to deprocess those thick metal and IMD layers using conventional PFA workflows. In this paper, the Fast Laser Deprocessing Technique (FLDT) is proposed to remove the BEOL thick and stubborn metal layers for memory PFA. The proposed FLDT is a cost-effective and quick way to deprocess a sample for defect identification in PFA.

Contributions of a Formal Analysis Metaprocess to Breakthrough Failure Analysis Results

2003 ◽  
Author(s):  
Steve Ferrier ◽  
Kevin D. Martin ◽  
Donald Schulte
Keyword(s):  
Failure Analysis ◽  
Formal Analysis ◽  
Photon Emission ◽  
Flow Analysis ◽  
Formal Structure ◽  
Ic Design ◽  
Analysis Process ◽  
Secondary Failure ◽  
Leakage Failure ◽  
Wafer Manufacturing

Abstract Application of a formal Failure Analysis metaprocess to a stubborn yield loss problem provided a framework that ultimately facilitated a solution. Absence of results from conventional failure analysis techniques such as PEM (Photon Emission Microscopy) and liquid crystal microthermography frustrated early attempts to analyze this low-level supply leakage failure mode. Subsequently, a reorganized analysis team attacked the problem using a specific toplevel metaprocess.(1,a) Using the metaprocess, analysts generated a specific unique step-by-step analysis process in real time. Along the way, this approach encouraged the creative identification of secondary failure effects that provided repeated breakthroughs in the analysis flow. Analysis proceeded steadily toward the failure cause in spite of its character as a three-way interaction among factors in the IC design, mask generation, and wafer manufacturing processes. The metaprocess also provided the formal structure that, at the conclusion of the analysis, permitted a one-sheet summary of the failure's cause-effect relationships and the analysis flow leading to discovery of the anomaly. As with every application of this metaprocess, the resulting analysis flow simply represented an effective version of good failure analysis. The formal and flexible codification of the analysis decision-making process, however, provided several specific benefits, not least of which was the ability to proceed with high confidence that the problem could and would be solved. This paper describes the application of the metaprocess, and also the key measurements and causeeffect relationships in the analysis.

Analogue IC Design: the Current Mode Approach

1992 ◽  
Vol 4 (3) ◽  
pp. 151
Author(s):  
G. Pearce
Keyword(s):  
Current Mode ◽  
Ic Design

Abrupt power-off detector for mobile TFT-LCD driver IC using dual power supply

2006 ◽  
Vol 42 (2) ◽  
pp. 83 ◽  
Author(s):  
J.-G. Lee ◽  
J.-H. Woo ◽  
B.-S. Kong ◽  
Y.-H. Jun ◽  
C.-G. Lee
Keyword(s):  
Power Supply ◽  
Lcd Driver ◽  
Dual Power

An area-saving and high power efficiency charge pump built in a TFT-LCD driver IC

2009 ◽  
Vol 30 (9) ◽  
pp. 095015
Author(s):  
Zheng Ran ◽  
Wei Tingcun ◽  
Wang Jia ◽  
Gao Deyuan
Keyword(s):  
High Power ◽  
Power Efficiency ◽  
Charge Pump ◽  
Lcd Driver ◽  
High Power Efficiency

Self-biased dual-path push-pull output buffer amplifier topology for LCD driver applications

2011 ◽  
Author(s):  
Davide Marano ◽  
Gaetano Palumbo ◽  
Salvatore Pennisi
Keyword(s):  
Output Buffer ◽  
Lcd Driver ◽  
Buffer Amplifier
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