Multi-Gate Fin Field-Effect Transistors Junctions Optimization by Conventional Ion Implantation for (Sub-)22 nm Technology Nodes Circuit Applications

2011 ◽  
Vol 50 (4S) ◽  
pp. 04DC16 ◽  
Author(s):  
Anabela Veloso ◽  
An De Keersgieter ◽  
Stephan Brus ◽  
Naoto Horiguchi ◽  
Philippe P. Absil ◽  
...  
2011 ◽  
Vol 50 (4) ◽  
pp. 04DC16 ◽  
Author(s):  
Anabela Veloso ◽  
An De Keersgieter ◽  
Stephan Brus ◽  
Naoto Horiguchi ◽  
Philippe P. Absil ◽  
...  

2009 ◽  
Vol 24 (2) ◽  
pp. 025012 ◽  
Author(s):  
Qiu-Hong Li ◽  
Takeshi Horiuchi ◽  
Shouyu Wang ◽  
Mitsue Takahashi ◽  
Shigeki Sakai

2020 ◽  
Vol 12 (02) ◽  
pp. 12-32
Author(s):  
E.L. Pankratov ◽  

In this paper we introduce an approach to increase density of field-effect transistors framework an enhanced swing differential Colpitts oscillator. Framework the approach we consider manufacturing the oscillator in heterostructure with specific configuration. Several required areas of the heterostructure should be doped by diffusion or ion implantation. After that dopant and radiation defects should by annealed framework optimized scheme. We also consider an approach to decrease value of mismatch-induced stress in the considered heterostructure. We introduce an analytical approach to analyze mass and heat transport in heterostructures during manufacturing of integrated circuits with account mismatch-induced stress


Author(s):  
E. L. Pankratov ◽  

In this paper, we introduce an approach to increase density of field-effect transistors framework a downconversion mixer circuit. Framework the approach we consider manufacturing the mixer in heterostructure with specific configuration. Several required areas of the heterostructure should be doped by diffusion or ion implantation. After that dopant and radiation defects should be annealed by framework optimized scheme. We also consider an approach to decrease value of mismatch-induced stress in the considered heterostructure. We introduce an analytical approach to analyze mass and heat transport in heterostructures during manufacturing of integrated circuits with account mismatch-induced stress.


2018 ◽  
Vol 57 (4S) ◽  
pp. 04FR11 ◽  
Author(s):  
Hironori Okumura ◽  
Sami Suihkonen ◽  
Jori Lemettinen ◽  
Akira Uedono ◽  
Yuhao Zhang ◽  
...  

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