Application of Novel Ultrasonic Cleaning Equipment That Uses the Waveguide Mode for the Single-Wafer Cleaning Process

2011 ◽  
Vol 50 (5S1) ◽  
pp. 05EC10
Author(s):  
Kazunari Suzuki ◽  
Yasuhiro Imazeki ◽  
Ki Han ◽  
Shoichi Okano ◽  
Junichiro Soejima ◽  
...  
Keyword(s):  
Waveguide Mode ◽  
Cleaning Process ◽  
Ultrasonic Cleaning ◽  
Wafer Cleaning ◽  
Cleaning Equipment

Application of Novel Ultrasonic Cleaning Equipment That Uses the Waveguide Mode for the Single-Wafer Cleaning Process

2011 ◽  
Vol 50 (5) ◽  
pp. 05EC10 ◽  
Author(s):  
Kazunari Suzuki ◽  
Yasuhiro Imazeki ◽  
Ki Han ◽  
Shoichi Okano ◽  
Junichiro Soejima ◽  
...  
Keyword(s):  
Waveguide Mode ◽  
Cleaning Process ◽  
Ultrasonic Cleaning ◽  
Wafer Cleaning ◽  
Cleaning Equipment

Application of Novel Ultrasonic Cleaning Equipment Using Waveguide mode for Post-Chemical-Mechanical-Planarization Cleaning

2009 ◽  
Vol 48 (7) ◽  
pp. 07GM04 ◽  
Author(s):  
Kazunari Suzuki ◽  
Ki Han ◽  
Shoichi Okano ◽  
Jyunichiro Soejima ◽  
Yoshikazu Koike
Keyword(s):  
Waveguide Mode ◽  
Chemical Mechanical Planarization ◽  
Ultrasonic Cleaning ◽  
Cleaning Equipment

Novel Ultrasonic Cleaning Equipment Using Waveguide Mode

2009 ◽  
Vol 48 (7) ◽  
pp. 07GM05 ◽  
Author(s):  
Kazunari Suzuki ◽  
Ki Han ◽  
Shoichi Okano ◽  
Jyunichiro Soejima ◽  
Yoshikazu Koike
Keyword(s):  
Waveguide Mode ◽  
Ultrasonic Cleaning ◽  
Cleaning Equipment

Effect of Dissolved Oxygen on Cu Corrosion in Single Wafer Cleaning Process

2009 ◽  
Vol 48 (4) ◽  
pp. 04C023 ◽  
Author(s):  
Masayoshi Imai ◽  
Yukinari Yamashita ◽  
Takashi Futatsuki ◽  
Morio Shiohara ◽  
Seiichi Kondo ◽  
...  
Keyword(s):  
Dissolved Oxygen ◽  
Cleaning Process ◽  
Wafer Cleaning ◽  
Cu Corrosion

Study of Static Electricity in Wafer Cleaning Process

2007 ◽  
Vol 134 ◽  
pp. 263-266 ◽  
Author(s):  
Masayuki Wada ◽  
T. Sueto ◽  
H. Takahashi ◽  
N. Hayashi ◽  
Atsuro Eitoku
Keyword(s):  
Cleaning Process ◽  
Static Electricity ◽  
Wafer Cleaning

A Comparative Study for the Backside Illumination (BSI) Technology Using Bonding Wafer Cleaning Process for Advanced CMOS Image Sensor

2012 ◽  
Vol 195 ◽  
pp. 75-78
Author(s):  
Chung Kyung Jung ◽  
Sung Wook Joo ◽  
Seoung Hun Jeong ◽  
Sang Wook Ryu ◽  
Han Choon Lee ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Comparative Study ◽  
Quantum Efficiency ◽  
Wafer Bonding ◽  
Image Sensor ◽  
Silicon On Insulator ◽  
Cleaning Process ◽  
Electrochemical Systems ◽  
Wafer Cleaning ◽  
Direct Wafer Bonding

Over the last decades, the concept of backside illumination (BSI) sensors has become one of the leading solutions to optical challenges such as improved quantum efficiency (QE), and cross-talk, respectively [1-. Direct wafer bonding is a method for fabricating advanced substrates for micro-electrochemical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer.

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