Direct fabrication of diffraction grating onto organic single crystals by electron beam lithography

2018 ◽  
Vol 57 (3S2) ◽  
pp. 03EH11 ◽  
Author(s):  
Yoshihiro Kawata ◽  
Kazuki Aoki ◽  
Yuhi Inada ◽  
Takeshi Yamao ◽  
Shu Hotta
2020 ◽  
pp. 2150144
Author(s):  
Yunhui Dong ◽  
Wei He ◽  
Wen Zhang ◽  
Mingli Dong

An equal-period plane diffraction grating fabricated through electron beam lithography line-by-line method was designed and applied to the experiment of angle sensitivity testing. The size of the fabricated grating region was [Formula: see text] mm and the period was 1526 nm. The incident light was transmitted via the Y-type fiber to collimator lens fixed on the angle disc, which can be adjusted to change the incident light angle. The diffraction spectra generated by the incident light irradiating the grating surface were collected by the optical spectrum analyzer. In this experiment, the incident light angle was fixed at 25[Formula: see text]. When the spot moved horizontally by 50 mm, the diffraction wavelength was basically unchanged. When the incident light angle was adjusted from 15[Formula: see text] to 31[Formula: see text], the diffraction wavelength was changed from 834.03 nm to 1589.80 nm, the angular sensitivity was 47.508 nm/[Formula: see text], and the linearity was 0.9998.


2003 ◽  
Vol 42 (Part 1, No. 9A) ◽  
pp. 5602-5606 ◽  
Author(s):  
Masato Okano ◽  
Hisao Kikuta ◽  
Yoshihiko Hirai ◽  
Kazuya Yamamoto ◽  
Tsutom Yotsuya

2009 ◽  
Vol 86 (4-6) ◽  
pp. 1314-1316 ◽  
Author(s):  
Daniel M. Koller ◽  
Nicole Galler ◽  
Harald Ditlbacher ◽  
Andreas Hohenau ◽  
Alfred Leitner ◽  
...  

Author(s):  
Masato Okano ◽  
Tsutom Yotsuya ◽  
Hisao Kikuta ◽  
Yoshihiko Hirai ◽  
Kazuya Yamamoto

1998 ◽  
Vol 153 (4-6) ◽  
pp. 223-225 ◽  
Author(s):  
Rosa Maria Montereali ◽  
Antonella Mancini ◽  
Giancarlo C Righini ◽  
Stefano Pelli

2000 ◽  
Vol 36 (5) ◽  
pp. 3002-3004 ◽  
Author(s):  
J.I. Martin ◽  
J.L. Vicent ◽  
J.L. Costa-Kramer ◽  
J.L. Menendez ◽  
A. Cebollada ◽  
...  

2004 ◽  
Vol 43 (27) ◽  
pp. 5137 ◽  
Author(s):  
Masato Okano ◽  
Hisao Kikuta ◽  
Yoshihiko Hirai ◽  
Kazuya Yamamoto ◽  
Tsutom Yotsuya

Author(s):  
L. D. Jackel

Most production electron beam lithography systems can pattern minimum features a few tenths of a micron across. Linewidth in these systems is usually limited by the quality of the exposing beam and by electron scattering in the resist and substrate. By using a smaller spot along with exposure techniques that minimize scattering and its effects, laboratory e-beam lithography systems can now make features hundredths of a micron wide on standard substrate material. This talk will outline sane of these high- resolution e-beam lithography techniques.We first consider parameters of the exposure process that limit resolution in organic resists. For concreteness suppose that we have a “positive” resist in which exposing electrons break bonds in the resist molecules thus increasing the exposed resist's solubility in a developer. Ihe attainable resolution is obviously limited by the overall width of the exposing beam, but the spatial distribution of the beam intensity, the beam “profile” , also contributes to the resolution. Depending on the local electron dose, more or less resist bonds are broken resulting in slower or faster dissolution in the developer.


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