scholarly journals Development of Implantable Blood Pressure Sensor Using Quartz Wafer Direct Bonding and Ultrafast Laser Cutting

2016 ◽  
Vol 37 (5) ◽  
pp. 168-177 ◽  
Author(s):  
Sung-Il Kim ◽  
Eung-Bo Kim ◽  
Sang-kyun So ◽  
Jiyeon Choi ◽  
Yeun-Ho Joung
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor ◽  
Laser Cutting ◽  
Ultrafast Laser ◽  
Quartz Wafer ◽  
Wafer Direct Bonding

scholarly journals Characteristics of an Implantable Blood Pressure Sensor Packaged by Ultrafast Laser Microwelding

Sensors ◽  
2019 ◽  
Vol 19 (8) ◽  
pp. 1801 ◽  
Author(s):  
Sungil Kim ◽  
Jaesoon Park ◽  
Sangkyun So ◽  
Sanghoon Ahn ◽  
Jiyeon Choi ◽  
...  
Keyword(s):  
Blood Pressure ◽  
Laser Welding ◽  
Pressure Sensor ◽  
Ultrafast Laser ◽  
Large Temperature ◽  
Implantable Sensors ◽  
Welding Seam ◽  
Packaging Process ◽  
Resonance Frequencies ◽  
Laser Microwelding

We propose a new packaging process for an implantable blood pressure sensor using ultrafast laser micro-welding. The sensor is a membrane type, passive device that uses the change in the capacitance caused by the membrane deformation due to applied pressure. Components of the sensor such as inductors and capacitors were fabricated on two glass (quartz) wafers and the two wafers were bonded into a single package. Conventional bonding methods such as adhesive bonding, thermal bonding, and anodic bonding require considerable effort and cost. Therefore CO2 laser cutting was used due to its fast and easy operation providing melting and bonding of the interface at the same time. However, a severe heat process leading to a large temperature gradient by rapid heating and quenching at the interface causes microcracks in brittle glass and results in low durability and production yield. In this paper, we introduce an ultrafast laser process for glass bonding because it can optimize the heat accumulation inside the glass by a short pulse width within a few picoseconds and a high pulse repetition rate. As a result, the ultrafast laser welding provides microscale bonding for glass pressure sensor packaging. The packaging process was performed with a minimized welding seam width of 100 μm with a minute. The minimized welding seam allows a drastic reduction of the sensor size, which is a significant benefit for implantable sensors. The fabricated pressure sensor was operated with resonance frequencies corresponding to applied pressures and there was no air leakage through the welded interface. In addition, in vitro cytotoxicity tests with the sensor showed that there was no elution of inner components and the ultrafast laser packaged sensor is non-toxic. The ultrafast laser welding provides a fast and robust glass chip packaging, which has advantages in hermeticity, bio-compatibility, and cost-effectiveness in the manufacturing of compact implantable sensors.

Cantilever arrayed blood pressure sensor for arterial applanation tonometry

2014 ◽  
Vol 8 (1) ◽  
pp. 37-43 ◽  
Author(s):  
Byeungleul Lee ◽  
Jinwoo Jeong ◽  
Jinseok Kim ◽  
Bonghwan Kim ◽  
Kukjin Chun
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor ◽  
Applanation Tonometry

Implantable blood pressure sensor for analyzing elasticity in arteries

2009 ◽  
Author(s):  
Marco Franco-Ayala ◽  
Fernando Martínez-Piñón ◽  
Alfredo Reyes-Barranca ◽  
Salvador Sánchez de la Peña ◽  
José A. Álvarez-Chavez
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor

A Low-Range Drift-Free Bio-compatible Pressure Sensor Based on P(VDF-TrFE) Piezoelectric Thin Film

2009 ◽  
Vol 1222 ◽  
Author(s):  
Xiaoyang Li ◽  
Timothy Reissman ◽  
Fan Yu ◽  
Edwin C. Kan
Keyword(s):  
Thin Film ◽  
Blood Pressure ◽  
Pressure Sensor ◽  
Equivalent Circuit Model ◽  
Swelling Pressure ◽  
Pressure Monitoring ◽  
Sensing Element ◽  
Piezoelectric Resonance ◽  
Piezoelectric Thin Film

AbstractA low-range pressure sensor (0-100kPa) based on the P(VDF-TrFE) piezoelectric thin film is proposed, where the long-term drift is eliminated by operating near the piezoelectric resonance. The pressure sensor is designed for blood pressure and tissue swelling pressure monitoring. The poled 50μm±1μm P(VDF-TrFE) copolymer film is used as the sensing element, with all fabrication and assembly materials biocompatible. A modified Butterworth-Van Dyke (BVD) [1] equivalent circuit model is used to characterize the sensor behavior. The pressure sensor exhibits negligible drift in weeks of operation. The device shows a sensitivity of 0.038MHz/kPa resonance frequency shift under stress, which leads to a maximum readout change of 1.1%/kPa in the present setup.

Long-Term Validation of a Blood Pressure Sensor at the Chest

2013 ◽  
Author(s):  
J Solà ◽  
M Proença ◽  
A Falhi ◽  
D Ferrario ◽  
O Grossenbacher ◽  
...  
Keyword(s):  
Blood Pressure ◽  
Pressure Sensor

Design and sensitivity analysis of capacitive MEMS pressure sensor for blood pressure measurement

2020 ◽  
Vol 26 (8) ◽  
pp. 2371-2379 ◽  
Author(s):  
K. Srinivasa Rao ◽  
W. Samyuktha ◽  
D. Vazad Vardhan ◽  
B. Girish Naidu ◽  
P. Ashok Kumar ◽  
...  
Keyword(s):  
Blood Pressure ◽  
Sensitivity Analysis ◽  
Pressure Sensor ◽  
Pressure Measurement ◽  
Blood Pressure Measurement ◽  
Capacitive Mems
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