Connection setup and traffic aggregation in IP-based Elastic Optical Networks (EON)

To overcome the challenges of the increased IP traffic volume on the Internet, the IP/MPLS-based fixed grid DWDM network structure was proposed, which makes the interaction between both the IP layer and the optical wavelength routed fixed DWDM layer applicable. However, the deployment of this architecture was not only expensive, but power-consuming. The emerging optical Flexgrid networks technology is nowadays suggested to be the potential candidate for future optical transport networks. This is because it provides extremely flexible and spectrally effective resources utilisation. Therefore, it has attracted the attention of network operators, optical networks equipment manufacturers and the wider research and development society. In this research work, we propose a novel multilayer routing scheme for an IP/MPLS-based optical Flex-grid network, which is based on the protocol suite defined by the GMPLS architecture. Furthermore, we evaluate its behaviour in an online dynamic traffic scenario.

Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density

There is a strong market need for further miniaturization of microelectronic ceramic-based products; electronic components require an increasingly finer pitch interconnect. Screen-printing resolution is a limiting factor in further miniaturization of classical thick film. Photo imageable thick film technology (PITF) was proposed decades ago as a successor technology to thick film, to achieve finer pitch patterns. However, where classical multilayer thick film provides good routing and interconnect capabilities, but insufficient fine line resolution, PITF does the reverse: no multilayer routing but advanced fine line performance. A combination of PITF for fine pitch mounting with advanced MLTF for efficient routing has been developed, targeting a linewidth of 50 μm line/spaces and below. Test and demo panels were made, using combinations of PITF pastes and conventional screen-print materials. Results, process performance, and limiting factors are discussed.