Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density

2017 ◽  
Vol 14 (3) ◽  
pp. 94-99 ◽  
Author(s):  
Roland Tacken ◽  
Daniel Mitcan ◽  
Jasper Nab
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Limiting Factors ◽  
Limiting Factor ◽  
Fine Line ◽  
Fine Pitch ◽  
Print Materials ◽  
Multilayer Routing ◽  
Screen Print ◽  
Circuit Density

Abstract There is a strong market need for further miniaturization of microelectronic ceramic-based products; electronic components require an increasingly finer pitch interconnect. Screen-printing resolution is a limiting factor in further miniaturization of classical thick film. Photo imageable thick film technology (PITF) was proposed decades ago as a successor technology to thick film, to achieve finer pitch patterns. However, where classical multilayer thick film provides good routing and interconnect capabilities, but insufficient fine line resolution, PITF does the reverse: no multilayer routing but advanced fine line performance. A combination of PITF for fine pitch mounting with advanced MLTF for efficient routing has been developed, targeting a linewidth of 50 μm line/spaces and below. Test and demo panels were made, using combinations of PITF pastes and conventional screen-print materials. Results, process performance, and limiting factors are discussed.

Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias

2009 ◽  
Vol 6 (1) ◽  
pp. 6-12 ◽  
Author(s):  
Arne Albertsen ◽  
Koji Koiwai ◽  
Kyoji Kobayashi ◽  
Tomonori Oguchi ◽  
Katsumi Aruga
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Screen Printing ◽  
Flip Chip ◽  
High Density ◽  
Uv Laser ◽  
Fine Pitch ◽  
Ink Jet ◽  
Printing Ink ◽  
Base Substrate

This paper highlights the possible combination of technologies such as thick film screen printing, ink jet, and post-firing thin film processes in conjunction with laser-drilled fine vias to produce high-density, miniaturized LTCC substrates. To obtain the silver pattern on the inner layers, both conventional thick film printing and ink jet printing (using nano silver particle dispersed ink) were applied on the ceramic green sheets. The ink jet process made it possible to metallize fine lines with line/space = 30/30 μm. For interlayer connections, fine vias of 30 μm in diameter formed by UV laser were used. Then these sheets were stacked on top of each other and fired to obtain a base substrate. On this base substrate, fine copper patterns for flip chip mounting were formed by a thin film process. The surface finish consisted of a nickel passivation and a gold layer deposited by electroless plating. The combination of the three patterning processes for conducting traces and UV laser drilling of fine vias make it appear possible to realize fine pitch LTCC, for example, for flip chip device mounting.

Miniaturized Embossed Low Resistance Fine Line Coils in LTCC

2009 ◽  
Vol 6 (1) ◽  
pp. 42-48 ◽  
Author(s):  
R. Perrone ◽  
H. Bartsch de Torres ◽  
M. Hoffmann ◽  
M. Mach ◽  
J. Müller
Keyword(s):  
Thick Film ◽  
Cross Section ◽  
Screen Printing ◽  
Dimensional Accuracy ◽  
High Dimensional ◽  
Stencil Printing ◽  
Fine Line ◽  
Low Resistance ◽  
Whole Process ◽  
Line Widths

Embedded ceramic coils stand out because of their excellent dielectric, thermal, and RF properties. However the relatively high sheet resistance (low thickness) of printed thick-film conductors restricts their functionality for applications where current values of several amps are needed. Using embossed structures it is possible to manufacture conductors with increased thickness and low resistance on LTCC tapes. The manufacturing process for wide conductors with high dimensional accuracy was shown in previous publications. In this work fine line embossed structures with line widths and spaces of 50 and 75 μm respectively were realized. The cross section of the embossed channels was about 50 μm. The fine line screen printing, stencil printing, and the photo definable Fodel® processes were used to fill the small structures with thick-film ink. The whole process was used to manufacture several types of low resistance coils in LTCC that can be used for current values up to approximately 3 A. They were realized as embedded as well as SMD components. Thus, the functionality of LTCC modules and LTCC SMD coils was increased. In this paper, the filling and patterning characteristics of all structuring methods are compared and the results discussed. Furthermore, the advantages of this process are shown by electrical, thermal, and RF measurements.

scholarly journals SCREEN PRINTING PROCESS DESIGN OF EXPERIMENTS FOR FINE LINE PRINTING OF THICK FILM CERAMIC SUBSTRATES

1999 ◽  
Vol 09 (03) ◽  
pp. 203-213 ◽  
Author(s):  
JIANBIAO PAN ◽  
GREGORY L. TONKAY ◽  
ALEJANDRO QUINTERO
Keyword(s):  
Design Of Experiments ◽  
Thick Film ◽  
Process Design ◽  
Screen Printing ◽  
Ceramic Substrates ◽  
Printing Process ◽  
Fine Line

Flexible PET Substrate for High Definition Printing of Polymer Thick Film Conductive Pastes

2018 ◽  
Vol 2018 (1) ◽  
pp. 000517-000527
Author(s):  
Art Dobie
Keyword(s):  
Thick Film ◽  
Line Width ◽  
Lead Time ◽  
Screen Printing ◽  
Field Testing ◽  
Printing Industry ◽  
Loss Of Control ◽  
High Definition ◽  
Circuit Density ◽  
Pet Substrate

Abstract A major obstacle in screen printing conductive low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the substantial spread of the pastes beyond the designed line width after printing. Industry observation and controlled testing have shown this spread can be as much as 80% over the circuit design's intended line width. This phenomenon prevents designers from increasing circuit density and/or reducing circuit real estate without incorporating other, more involved and higher cost patterning methods. In many cases, flexible circuit fabricators, desiring more accurate high definition circuit elements, may have to subcontract parts out of house in order to incorporate alternate patterning methods. In-turn this subcontracting leads to a loss of control of both cost and lead time. This paper will provide results of numerous in-house and field testing, comparing printed line width control, edge definition, and improved conductivity of printed polymer Ag conductors on different flexible PET substrates.

scholarly journals Flexible PET Substrate for High-Definition Printing of Polymer Thick-Film Conductive Pastes

2019 ◽  
Vol 16 (2) ◽  
pp. 103-116
Author(s):  
Art Dobie
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Line Width ◽  
Lead Time ◽  
Screen Printing ◽  
Printing Industry ◽  
Loss Of Control ◽  
High Definition ◽  
Circuit Density ◽  
Pet Substrate

Abstract A major obstacle in screen printing conductive low-temperature curing polymer thick-film (PTF) pastes onto common flexible PET substrate materials is the substantial spread of the pastes beyond the designed line width after printing. Industry observation and controlled testing have shown this spread can be as much as 80% over the circuit design's intended line width. This phenomenon prevents designers from increasing circuit density and/or reducing circuit real estate without incorporating other more involved and higher cost patterning methods. In many cases, flexible circuit fabricators, desiring more accurate high-definition circuit elements, may have to subcontract parts out of house to incorporate alternate patterning methods. This subcontracting, in turn, leads to a loss of control of both cost and lead time. This article will provide results of numerous in-house and field testings, comparing printed line width control, edge definition, and improved conductivity of printed polymer Ag conductors on different flexible PET substrates.

Structural and Optoelectronic Properties of Polycrystalline CdS Thick Film Prepared by Screen Printing

2018 ◽  
Vol 10 (5) ◽  
pp. 05018-1-05018-4
Author(s):  
B. Y. Bagul ◽  
◽  
P. S. Sonawane ◽  
A. Z. Shaikh ◽  
Y. N. Rane ◽  
...  
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Optoelectronic Properties ◽  
Structural And Optoelectronic Properties

Characterization of a LiCoO2 thick film by screen-printing for a lithium ion micro-battery

2006 ◽  
Vol 159 (2) ◽  
pp. 1416-1421 ◽  
Author(s):  
Moon Soo Park ◽  
Sang Hoon Hyun ◽  
Sang Cheol Nam
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Lithium Ion

Electrical and Microstructural Analysis of Contact Formation on Lightly Doped Phosphorus Emitters Using Thick-Film Ag Screen Printing Pastes

2014 ◽  
Vol 4 (1) ◽  
pp. 168-174 ◽  
Author(s):  
Vinodh Shanmugam ◽  
Jessen Cunnusamy ◽  
Ankit Khanna ◽  
Prabir Kanti Basu ◽  
Yi Zhang ◽  
...  
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Microstructural Analysis ◽  
Contact Formation
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