Abstract
A performance improvement by reduction in switching material thickness in a e-gun deposited SiOx based resistive switching memory device was investigated. Reduction in thickness cause thinner filamentary path formation during ON-state by controlling the vacancy defects. Thinner filament cause lowering of operation current from 500 μA to 100 μA and also improves the reset current (from >400 μA to <100 μA). Switching material thickness reduction also cause the forming free ability in the device. All these electrical parametric improvements enhance the device reliability performances. The device show >200 dc endurance, >3-hour data retention and >1000 P/E endurance with 100 ns pulses.
Performance Improvement in E-Gun Deposited SiOx- Based RRAM Device by Switching Material Thickness Reduction
