Three Cases of Gradual Degradation Mode Analysis of Semiconductor Laser Diodes

Semiconductor laser diodes are important components for various applications such as 5G wireless, datacenter, passive optical network, and aerospace applications. High reliability has emerged to be the universal requirement for all optical applications. To achieve high reliability, fundamental understanding of the laser degradation behavior is crucial. In this paper, we study three cases of gradual degradataion modes of laser diodes including (1) Pattern-A that is associated with threshold current change only, (2) Pattern-B that involve both threshold current and power changes, and (3) Pattern-C that is associated with merely power change. We have instituted reliability equations for the degradation processes. The new reliability models could provide estimation on the laser end-of-life based on the degradation rate and device performance specification.

A Realization of Stabilizing the Output Light Power from a Laser Diode: A Practical Approach

Semiconductor Laser Diodes (LDs) are known for their sensitivity to variation in ambient temperature. With the rise in case temperature the threshold current of the LD increases, causing the output light power to deteriorate drastically. Therefore, it is necessary to stabilize the temperature of the diode. Various approaches could be adopted in this regard. In this paper, an active cooling approach using the temperature compensation technique has been followed and presented in the form of a full design of the circuit according to the various datasheet parameters of the LD and other components. As a result of temperature stabilization, a significant improvement in the output light power stabilization was observed and the results are presented.

Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode

In this paper, the vacuum reflow soldering technology for semiconductor laser chips in optoelectronic devices was studied and analyzed in a systematic manner. Through the study on the key elements in the reflow soldering process, such as the selection of solders, <a>chamber</a> vacuum, flux, and the pressure applied by the fixture on the chip, this paper focused on exploring the formation mechanism of voids in the solder layer when the device was resoldered. Also, the change in the movement of gas bubbles in the voids with changing reflow oven chamber conditions and its underlying law were analyzed, by preparing 200 C-package semiconductor laser diodes and verifying the reliability and stability of the theoretical analysis through inspection and test aging. which could provide a theoretical basis for the use of the vacuum reflow soldering technology to reduce the void rate in the soldering process of devices.

Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode

In this paper, the vacuum reflow soldering technology for semiconductor laser chips in optoelectronic devices was studied and analyzed in a systematic manner. Through the study on the key elements in the reflow soldering process, such as the selection of solders, <a>chamber</a> vacuum, flux, and the pressure applied by the fixture on the chip, this paper focused on exploring the formation mechanism of voids in the solder layer when the device was resoldered. Also, the change in the movement of gas bubbles in the voids with changing reflow oven chamber conditions and its underlying law were analyzed, by preparing 200 C-package semiconductor laser diodes and verifying the reliability and stability of the theoretical analysis through inspection and test aging. which could provide a theoretical basis for the use of the vacuum reflow soldering technology to reduce the void rate in the soldering process of devices.

High-reliability, High-performance 25 Gb/s Directly Modulated Uncooled Lasers for 5G Wireless Communications

Semiconductor laser diodes are important components for fifth-generation wireless technologies. To meet 5G wireless specifications, ever increasing performance and reliability requirements of each component become necessary to guarantee uptime air service. In this paper, we present highly reliable 25G DFB uncooled lasers that exhibit low threshold current, high single-mode, high bandwidth, and excellent eye pattern for uncooled operations of -40 to 85°C. Ultra-high component reliability is demonstrated to ensure stable operations for 5G mobile communications.