Study of the Electrochemical Dissolution Behavior of Nitinol Shape Memory Alloy in Different Electrolytes for Micro-ECM Process

Nickel-Titanium alloy (Nitinol) is an excellent shape memory alloy (SMA) for Micro electro-mechanical systems (MEMS) particularly in biomedical applications owing to its three excellent features like shape memory effect (SME), superelasticity, and biocompatibility. The fabrication of micro features on Nitinol SMAs through conventional machining has been challenging due to its temperature-dependent material transformation properties. Micro electrochemical machining (micro-ECM), a nonconventional machining method for conductive material irrespective of strength and hardness has the potential for microfeature fabrication on Nitinol. This study presents the investigation on electrochemical dissolution behavior of Nitinol in different electrolytes for micro-ECM. The influence of electrolytes on the nature of dissolution of Nitinol has been studied by fabricating microchannels in three levels of parameters containing applied voltage and electrolyte concentration. The first three electrolytes were all aqueous neutral electrolytes i.e. sodium chloride (NaCl), sodium nitrate (NaNO3), and sodium bromide (NaBr). For profound analysis of dissolution behavior and its influence on machining performance, potentiodynamic polarization (PDP) tests of Nitinol were performed in aqueous NaCl, aqueous NaNO3, and aqueous NaBr solutions. The PDP tests that are conducted here are cyclic voltammetry (CV) and linear sweep voltammetry (LSV). The three aqueous solutions were utilized for microchannel fabrication in Nitinol through micro ECM in three levels of parameters out of which aqueous NaNO3 was successful in fabricating microchannel. Then nonaqueous electrolyte of ethylene glycol-based NaNO3 has been used to fabricate microchannels with lower depth overcut (DOC), width overcut (WOC), and length overcut (LOC) with respect to aqueous NaNO3 electrolyte.

Micro-ECM of the Aerodynamic Surface Understating

This paper demonstrates that 18 μm deep surface understating with a tolerance of 4.5 μm and a roughness Ra=0.4 μm can be produced to the required accuracy by electrochemical die-sinking if configured appropriately.Theoretical analysis shows that the bottom profile error can be presented as a superposition of the errors of surface alignment (non-parallel bottom) and shape (non-flat bottom). In this case, the alignment error accounts for a greater part of the size tolerance (3 μm out of 4.5 μm). This is why the attainment of desired accuracy revolves around the development, analysis, and assessment of ways to reduce this error.

Micro Electrochemical Machining of Array Micro-Grooves Using In-Situ Disk Electrode Fabricated by Micro-WEDM

This paper develops an array micro-grooves manufacturing method using micro electrochemical machining (ECM) with disk electrode, which is prepared by in-situ micro wire electrical discharge machining (WEDM). This technology focuses on the difficulty of array structure manufacture in micro-electro-mechanical systems (MEMS). A micro-ECM system is built based on the micro-WEDM machine to achieve high precision processing of the array micro-grooves. Since micro-WEDM has good performance in high precision machining of the rotating structure, single and multi-edge disk electrodes can be fabricated in-situ using graphite. The as-prepared disk tool electrode is directly used for micro-electrochemical milling of the array micro-grooves without disassembling away from the device, which avoids the positioning error caused by the re-clamping of the disk electrode. With the advantages of high surface quality and no electrode loss, micro-ECM improves the manufacture performance of the micro-parts. Through wire path optimization, the shape accuracy of the disk edge is improved. After the research of the micro-ECM parameters, the process is improved, and finally, the high precision array micro-grooves are obtained. This method combines the advantages of micro-WEDM and disk electrode micro-ECM milling, and it is convenient for large-scale manufacture of array micro-structures on micro-parts and MEMS.