Quantitative Imaging of the Stress/Strain Fields and Generation of Macroscopic Cracks from Indents in Silicon

The crack geometry and associated strain field around Berkovich and Vickers indents on silicon have been studied by X-ray diffraction imaging and micro-Raman spectroscopy scanning. The techniques are complementary, the Raman data coming from within a few micrometers of the indentation, whereas the X-ray image probes the strain field at a distance of typically tens of micrometers. For example, Raman data provides an explanation for the central contrast feature in the X-ray images of an indent. Strain relaxation from breakout and high temperature annealing are examined and it is demonstrated that millimeter length cracks, similar to those produced by mechanical damage from misaligned handling tools, can be generated in a controlled fashion by indentation within 75 micrometers of the bevel edge of 200mm diameter wafers.

INCREASE IN PRODUCTION RESOURCE OF TOOLS FOR AUTOMATED TECHNOLOGICAL ENVIRONMENT

The formation of wear areas on a tool changes power-, temperature and also accuracy quality charac-teristics of a treatment process. The distribution of al-lowance between technological transitions at the use of automated equipment brings the conditions of a cutting process closer to semifinish or finish ones that contributes to control effectively technological heredity. Work surface wear can be estimated through the time τ of a cutting process duration or through the length L of the way in the direction of cutting motion which allows predicting the increase in machining effectiveness based on a rational use of cutters properties. Breakingin and steady wear at rotary cutting increase because of the increase of a cutting edge extension. The application of plasma nano-technologies in material treatment in a glow discharge in controlled gaseous medium allows carrying out changes in the structure on the surface of tools reducing the period of tool breakingin and increasing a steady wear period because of the boundary layer reduction and grinding a source material grain for a specified depth of 0.2…03 mm, that is, commensurable with an optimum bevel edge of tool wear. Tools with continuous single renewal of a cutting edge at optimum wear can realize large ways of cutting L or time τ of a cutting process to carry out a travel of any size.