Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

2009 ◽  
Vol 21 (3) ◽  
pp. 4-9
Author(s):  
Yi‐Shao Lai ◽  
C.R. Kao ◽  
Hsiao‐Chuan Chang ◽  
Chin‐Li Kao
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles

Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu ◽  
Chang-Lin Yeh ◽  
Jenn-Ming Song
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

2007 ◽  
Vol 37 (2) ◽  
pp. 201-209 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

2012 ◽  
Vol 48 (6) ◽  
pp. 2724-2732 ◽  
Author(s):  
Cheng-Ying Ho ◽  
Jenq-Gong Duh ◽  
Chih-Wei Lin ◽  
Chun-Jen Lin ◽  
Yu-Hui Wu ◽  
...  
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
High Speed Impact ◽  
Impact Responses

scholarly journals Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

2016 ◽  
Vol 108 ◽  
pp. 418-428 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
S.D. McDonald ◽  
C.M. Gourlay ◽  
H. Yasuda ◽  
K. Nogita
Keyword(s):  
Solder Joints ◽  
Multiple Reflow Cycles

Characterizations of ball impact responses of wafer-level chip-scale packages

2008 ◽  
Vol 450 (1-2) ◽  
pp. 238-244 ◽  
Author(s):  
Yi-Shao Lai ◽  
Chang-Lin Yeh ◽  
Hsiao-Chuan Chang ◽  
Chin-Li Kao
Keyword(s):  
Wafer Level ◽  
Ball Impact ◽  
Impact Responses
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