Microstructure evolution of Sn-Cu based solder paste on electroless nickel immersion gold (ENIG) surface finish subjected to multiple reflow cycles

2021 ◽  
Author(s):  
Rita Mohd Said ◽  
Muhammad Alif Haikal Abdul Ghani ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh
Keyword(s):  
Microstructure Evolution ◽  
Surface Finish ◽  
Electroless Nickel ◽  
Solder Paste ◽  
Electroless Nickel Immersion Gold ◽  
Multiple Reflow Cycles

Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

2018 ◽  
Vol 280 ◽  
pp. 206-211 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Nur Ain Athirah Amran ◽  
Mohd Izrul Izwan Ramli
Keyword(s):  
Intermetallic Compound ◽  
Microstructure Evolution ◽  
Bulk Solder ◽  
Solder Paste ◽  
Microstructure Formation ◽  
Cu Content ◽  
Microstructure Morphology ◽  
Solder Microstructure ◽  
Multiple Reflow Cycles ◽  
Solder Composition

The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added into SC solder paste to produce new Sn-4Cu and Sn-10Cu solder paste. After that, the solder paste was then reflowed on Cu-OSP surface finished and subjected to six times reflows. Characterization focuses on the bulk solder microstructure, morphology and intermetallic compound (IMC) thickness after multiple reflows. Results reveal that solder composition significantly affect the microstructure formation and growth of IMC.

Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment

2016 ◽  
Vol 2016 (1) ◽  
pp. 000117-000122 ◽  
Author(s):  
Cong Zhao ◽  
Thomas Sanders ◽  
Zhou Hai ◽  
Chaobo Shen ◽  
John L. Evans
Keyword(s):  
Surface Finish ◽  
Isothermal Aging ◽  
Electroless Nickel ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Surface Mount ◽  
Surface Finishes ◽  
Free Solder ◽  
Immersion Silver

Abstract This paper investigates the effect of long term isothermal aging and thermal cycling on the reliability of lead-free solder mixes with different solder compositions, PCB surface finishes, and isothermal aging conditions. A variety of surface mount components are considered, including ball grid arrays (BGAs), quad flat no-lead packages (QFNs) and 2512 Surface Mount Resistors (SMRs). 12 lead-free solder pastes are tested; for BGA packages these are reflowed with lead-free solder spheres of SAC105, SAC305 and matched doped solder spheres (“matched” solder paste and sphere composition). Three surface finishes are tested: Organic Solderability Preservative (OSP), Immersion Silver (ImAg), and Electroless Nickel Immersion Gold (ENIG). All test components are subjected to isothermal aging at 125°C for 0 or 12 months, followed by accelerated thermal cycle testing from −40°C to 125°C. Data from the first 1500 cycles is presented here, with a focus on the effect of surface finish on package reliability. Current results demonstrate that the choice of surface finish has a strong effect on reliability. However, different solder materials appear to show different reliability trends with respect to the surface finishes, and the reliability trends of BGA and SMR packages also diverge.

Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish

2011 ◽  
Vol 40 (9) ◽  
pp. 1937-1942 ◽  
Author(s):  
Q. V. Bui ◽  
N. D. Nam ◽  
J. W. Yoon ◽  
D. H. Choi ◽  
A. Kar ◽  
...  
Keyword(s):  
Corrosion Behavior ◽  
Surface Finish ◽  
Electroless Nickel ◽  
Gold Surface ◽  
Electroless Nickel Immersion Gold

Reliability of electronics assembled using SAC + Zn solder pastes

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000051-000057 ◽  
Author(s):  
H.R. Kotadia ◽  
A. Panneerselvam ◽  
M.A. Green ◽  
M.P. Clode ◽  
S.H. Mannan ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Electroless Nickel ◽  
Temperature Cycling ◽  
Solder Paste ◽  
Reflow Process ◽  
Reliable Operation ◽  
Interfacial Imcs ◽  
Electroless Nickel Immersion Gold ◽  
Reliability Of Electronics ◽  
Sac Solder

A method of preparing SAC solder with addition of 1.0-1.5wt.% Zn to Sn-3.8Ag-0.7Cu solder alloy such that a standard solder paste reflow process results in good soldering is described. Solder-substrate couples were aged at 150°C for 1000h, and results on temperature cycling (−20 to 175°C) and shear testing of solder joints is also described. The added Zn segregated to the interfacial IMCs so that Cu6Sn5 became (Cu,Zn)6Sn5 and (Cu,Ni)6Sn5 became (Cu,Ni,Zn)6Sn5. The reliability of assemblies utilizing Electroless Nickel Immersion Gold (ENIG) using the Zn enhanced solder is compared to that of standard SAC solder alloy for potentially reliable operation at temperature up to 185°C.

Nanoindentation of Sn3.0Ag0.5Cu/ENIG Solder Joint after High Temperature Storage

2016 ◽  
Vol 857 ◽  
pp. 40-43 ◽  
Author(s):  
Maria Abu Bakar ◽  
Azman Jalar ◽  
Roslina Ismail ◽  
Abdul Razak Daud
Keyword(s):  
High Temperature ◽  
Electroless Nickel ◽  
Solder Paste ◽  
Reflow Soldering ◽  
Micromechanical Properties ◽  
Electroless Nickel Immersion Gold ◽  
Reduced Modulus ◽  
High Temperature Storage ◽  
Free Solder ◽  
Temperature Storage

This study used nanoindentation technique in order to examine the micromechanical properties of Sn3.0Ag0.5Cu (SAC305) on Electroless Nickel Immersion Gold (ENIG) surface finished Cu substrate subjected to high temperature storage. Lead free solder paste of SAC305 were soldered on ENIG substrate by reflow soldering at 215 °C for 8 second. The soldered samples were exposed to high temperature storage at 180 °C for 0, 200, 400, 600, 800 and 1000 hours. Micromechanical properties show that the solder hardness is decreasing with the HTS time from 239.13 MPa for 0 hour to 178.96 MPa for 1000 hours while the reduce modulus results has increased from 62. 16 x 103 MPa for 0 hour to 82.13 x 103 MPa for 1000 hours. The value of hardness and reduced modulus from nanoindentation approach indicate the occurrence of plastic and elastic deformation throughout the test.

The pH effect on black spots in surface finish: Electroless nickel immersion gold

2010 ◽  
Vol 257 (1) ◽  
pp. 56-61 ◽  
Author(s):  
Yong Sun Won ◽  
Sung Soo Park ◽  
Jinuk Lee ◽  
Jong-Yun Kim ◽  
Seong-Jae Lee
Keyword(s):  
Surface Finish ◽  
Ph Effect ◽  
Electroless Nickel ◽  
Electroless Nickel Immersion Gold ◽  
Black Spots
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