nickel electrodeposit
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2013 ◽  
Vol 90 ◽  
pp. 507-513 ◽  
Author(s):  
F.J. Recio ◽  
P. Herrasti ◽  
L. Vazquez ◽  
C. Ponce de León ◽  
F.C. Walsh

2007 ◽  
Vol 201 (12) ◽  
pp. 5925-5930 ◽  
Author(s):  
Yundong Li ◽  
Hui Jiang ◽  
Lijuan Pang ◽  
Bao'an Wang ◽  
Xiaohui Liang

2006 ◽  
Vol 16 (1) ◽  
pp. 209-216 ◽  
Author(s):  
Zhong-nian YANG ◽  
Zhao ZHANG ◽  
Wen-hua LENG ◽  
Ke LING ◽  
Jian-qing ZHANG

2005 ◽  
Vol 11 (4-5) ◽  
pp. 319-330 ◽  
Author(s):  
F. D. Wall ◽  
M. A. Martinez ◽  
J. J. Vandenavyle

Author(s):  
S. Nakahara

During the course of structural characterization of nickel electrodeposit, we have found that there are a large number of linear defects which are different from dislocations. This communication reports a detailed analysis of these defects using transmission electron microscopy.Nickel film was prepared by electrodeposition from a bath containing 0.43 M NiSO4-6H2O and 0.5 M H3BO3. The pH of the bath was adjusted to 1.5. A sheet of annealed OFHC copper was used as the substrate. All the platings were carried out at 30°C.Nickel film plated at a current density of 5 MA/cm2 contained these linear Refects. Figures l(a), (b), and (c) show micrographs of the film taken with g = 200, 220, and 131, respectively. The images of the defects are indicated by four fine arrows in Fig. 1(c). They were not easily discernible with low-order g's such as 111, 200, and 220 (see Figs. 1(a) and (b)).


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