Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration
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2008 ◽
Vol 39
(4)
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pp. 799-810
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2009 ◽
Vol 513-514
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pp. 64-71
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1992 ◽
Vol 191-194
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pp. 672-675
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2005 ◽
Vol 45
(3)
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pp. 410-412
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