Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

Author(s):  
Jie-Ying Zhou ◽  
Cheng Wei ◽  
Shui-Bao Liang ◽  
Han Jiang ◽  
Xiao Ma ◽  
...  
2004 ◽  
Vol 44 (6) ◽  
pp. 1103-1107 ◽  
Author(s):  
Q. C. Jiang ◽  
H. L. Sui ◽  
Q. F. Guan

2005 ◽  
Vol 45 (3) ◽  
pp. 410-412 ◽  
Author(s):  
Y. G. ZHAO ◽  
Y. H. LIANG ◽  
W. ZHOU ◽  
Q. D. QIN ◽  
Q. C. JIANG

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