A novel Ag-Cu lamination process

2007 ◽  
Author(s):  
Pin J. Wang ◽  
Jong S. Kim ◽  
Chin C. Lee
Keyword(s):  
Lamination Process

scholarly journals Multicriteria Optimization of the Mechanical Properties in Laminated Seams

Materials ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 2989
Author(s):  
Halina Szafranska ◽  
Ryszard Korycki
Keyword(s):  
Mechanical Properties ◽  
Optimization Problems ◽  
Comprehensive Evaluation ◽  
Relative Elongation ◽  
Weighted Average ◽  
Bending Rigidity ◽  
Elongation At Break ◽  
Lamination Process ◽  
Weighted Optimization ◽  
Generalized Utility

In order to ensure a comprehensive evaluation of laminated seams in working clothing, a series of research was carried out to determine the correlation between the parameters of the seam lamination process (i.e., the temperature, the time, the pressure) and the mechanical properties of laminated seams. The mechanical properties were defined by means of the maximum breaking force, the relative elongation at break and the total bending rigidity. The mechanical indexes were accepted as the measure of durability and stability of laminated seams. The correlation between the lamination process parameters and the final properties of the tested seams in working clothing was proposed using a three-factor plan 33. Finally, the single-criteria optimization was introduced and the objective functional is the generalized utility function U. Instead of three independent optimization problems, the single problem was applied, and the global objective function was a weighted average of partial criteria with the assumed weight values. The problem of multicriteria weighted optimization was solved using the determined weights and the ranges of acceptable/unacceptable values.

Enhanced Sensitivity and Reduced Noise Floor in Magnetoelectric Laminate Sensors by an Improved Lamination Process

2011 ◽  
Vol 94 (11) ◽  
pp. 3738-3741 ◽  
Author(s):  
Menghui Li ◽  
David Berry ◽  
Jaydip Das ◽  
David Gray ◽  
Jiefang Li ◽  
...  
Keyword(s):  
Noise Floor ◽  
Enhanced Sensitivity ◽  
Lamination Process

Control of a lamination process

2005 ◽  
Vol 219 (1) ◽  
pp. 69-81 ◽  
Author(s):  
R Whalley ◽  
M Ebrahimi
Keyword(s):  
High Speed ◽  
Closed Loop ◽  
Cost Effective ◽  
Closed Loop System ◽  
Design Validation ◽  
Control Effort ◽  
Speed Of Response ◽  
Feedback Compensation ◽  
Lamination Process ◽  
Compensation Design

A high-speed laminating machine for a fabric coating and conversion process is considered. Following analysis procedures, state-space and the admittance transfer function descriptions for the system are derived. Regulation of the fabric tension owing to heat shrinkage and environmental and coating variations is necessary. An optimum, minimum control effort strategy is proposed, enabling simple cost effective regulation, without the use of active elements. The speed of response of the system is improved by the use of feedback compensation. Design validation, via simulation, obtaining the open- and closed-loop system responses is employed, demonstrating the achievement of smooth, almost monotonic variations in tension following reference changes, as specified.

scholarly journals Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements

Micromachines ◽  
2021 ◽  
Vol 12 (6) ◽  
pp. 632
Author(s):  
Yuan Cao ◽  
Julia Floehr ◽  
Sven Ingebrandt ◽  
Uwe Schnakenberg
Keyword(s):  
Microfluidic Chip ◽  
Electrical Impedance ◽  
Microfluidic System ◽  
Equivalent Circuits ◽  
Proof Of Concept ◽  
Impedance Measurements ◽  
Close Match ◽  
Aspect Ratios ◽  
Lamination Process ◽  
Dry Film

In micro-electrical-mechanical systems (MEMS), thick structures with high aspect ratios are often required. Dry film photoresist (DFR) in various thicknesses can be easily laminated and patterned using standard UV lithography. Here, we present a three-level DFR lamination process of SUEX for a microfluidic chip with embedded, vertically arranged microelectrodes for electrical impedance measurements. To trap and fix the object under test to the electrodes, an aperture is formed in the center of the ring-shaped electrodes in combination with a microfluidic suction channel underneath. In a proof-of-concept, the setup is characterized by electrical impedance measurements with polystyrene and ZrO2 spheres. The electrical impedance is most sensitive at approximately 2 kHz, and its magnitudes reveal around 200% higher values when a sphere is trapped. The magnitude values depend on the sizes of the spheres. Electrical equivalent circuits are applied to simulate the experimental results with a close match.

Residual Stress Interaction against Mechanical Loading during the Manufacturing Process of an Assault Rifle Component

2011 ◽  
Vol 70 ◽  
pp. 482-487
Author(s):  
G. Urriolagoitia-Sosa ◽  
A. Molina-Ballinas ◽  
Vistor Fernando Cedeño Verduzco ◽  
B. Romero-Ángeles ◽  
G. Urriolagoitia-Calderón ◽  
...  
Keyword(s):  
Residual Stress ◽  
Stress Field ◽  
Manufacturing Process ◽  
Structural Changes ◽  
Harmful Effect ◽  
Residual Stress Field ◽  
Lamination Process ◽  
Punching Process ◽  
In Fire ◽  
Microstructure Of The Material

This paper presents results obtained on the harmful effect that a lamination process can cause in AISI 1018 steel during the manufacturing process of spring bed components in fire guns. The sequel presented by the induction of a residual stress field is analyzed as well. It has been established that the consequences produced by the residual stresses, could be minimized either by changing the geometric configuration of the component, or changing the manufacturing process, or regeneration of the microstructure of the material by heat treatment. This work analyzes the effects that consistently become apparent by the regeneration of the microstructure of the material, such as; level of the residual stress field, possible fracture and micro-structural changes. This article evaluates both the longitudinal and transverse residual stress that takes place during the punching process of the spring bed made of AISI 1018 steel. The Crack Compliance Method (CCM) for measurement the residual stress field was applied. Additionally, it is applied a micro-structural analysis of the component. A comparison between experimental results of grain size is shown. From this study it is possible to validate the correct behavior of the mechanical component and certify the expected useful life.

Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

1998 ◽  
Vol 515 ◽  
Author(s):  
Jin S. Kim ◽  
Kyung W. Paik ◽  
Seung H. Oh ◽  
Hyun S. Seo
Keyword(s):  
Polymer Films ◽  
Coefficient Of Thermal Expansion ◽  
Relaxation Effect ◽  
Mechanical Stresses ◽  
Silicon Substrates ◽  
Elastic Model ◽  
Individual Layer ◽  
Number Of Layers ◽  
Curvature Measurement ◽  
Lamination Process

ABSTRACTThermo-mechanical stresses in MCM-D substrate are important reliability and fabrication issues. The differences in coefficient of thermal expansion (CTE) between substrate, polymer, and metal leads to complicated stress fields in multilevel interconnect structures. While the majority of reports in the literature have focused on spin-coated polyimides, this paper mainly focuses on laminated polymer dielectrics. This study uses material sets representing typical MCM-D structures to monitor the stress level in the polymer films. The substrate deflection caused by composite stresses during fabrication and thermal cycling test is determined by a curvature measurement technique. A simple analytical model which predicts a stress contribution from each individual layer during MCM-D substrate fabrication is proposed and developed by computer simulation as well. The composite stress or bowing in multilayer structures is due to the summation of each individual layer contribution. From a thermo-mechanical stress viewpoint, Ultem® thermoplastic and the epoxy thermoset adhesive exhibit quite different behaviors. In case of the epoxy thermoset adhesive, the amount of bowing increases as number of layers increases and its behavior can be predicted by an elastic model. However, in the case of the Ultem® thermoplastic adhesive, bow values become stabilized as number of layers increases because of the stress relaxation effect of the thermoplastic adhesive during lamination process above Tg of the Ultem® thermoplastic.

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