27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
Latest Publications

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Published By IEEE

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Automatic wedge bonding with ribbon wire for high frequency applications

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032732 ◽

2003 ◽

Cited By ~ 3

Author(s):

Ivy Wei Qin ◽

P. Reid ◽

R.E. Werner ◽

D. Doerr

Keyword(s):

High Frequency ◽

Wedge Bonding

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Optimizing test strategies during PCB design for boards with limited ICT access

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032780 ◽

2003 ◽

Cited By ~ 4

Author(s):

A. Verma

Keyword(s):

Test Strategies ◽

Pcb Design

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Laser processing - the future of HDI manufacturing

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032742 ◽

2003 ◽

Cited By ~ 3

Author(s):

S. Venkat ◽

T. Hannon

Keyword(s):

Laser Processing ◽

The Future

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A structured approach to lead-free IC assembly transitioning

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032758 ◽

2003 ◽

Cited By ~ 3

Author(s):

L. Nguyen ◽

R. Walberg ◽

Z. Lin ◽

T. Koh ◽

Y.Y. Bong ◽

...

Keyword(s):

Lead Free ◽

Structured Approach

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Flux-underfill compatibility and failure mode analysis in high yield flip chip processing

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032727 ◽

2003 ◽

Cited By ~ 2

Author(s):

P.N. Houston ◽

D.F. Baldwin ◽

W.M. Tsai

Keyword(s):

Failure Mode ◽

Flip Chip ◽

Mode Analysis ◽

High Yield ◽

Chip Processing ◽

Failure Mode Analysis

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Equivalent driver model for fast system simulation

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032765 ◽

2003 ◽

Author(s):

June Feng ◽

Ching-Chao Huang

Keyword(s):

System Simulation ◽

Driver Model ◽

Fast System

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Design and characterization of a high-performance wire-bond ball-grid-array package

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032762 ◽

2003 ◽

Author(s):

Ching-Chao Huang ◽

D. Secker ◽

Ling Yang ◽

June Feng ◽

Nirmal Jain

Keyword(s):

High Performance ◽

Ball Grid Array ◽

Wire Bond ◽

Ball Grid Array Package

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Decision support for test and debug areas in RF manufacturing

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032740 ◽

2003 ◽

Author(s):

S. Balasubramanian ◽

J. Arbulich ◽

J. Craik ◽

K. Srihari

Keyword(s):

Decision Support

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Removable tape using thermoplastic adhesive for QFN assembly process

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032750 ◽

2003 ◽

Cited By ~ 4

Author(s):

T. Kawai ◽

T. Nagoya ◽

H. Matsuura

Keyword(s):

Assembly Process

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Solving wire bond process challenges for QFN packaging

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2002.1032786 ◽

2003 ◽

Cited By ~ 1

Author(s):

E. McDivitt

Keyword(s):

Wire Bond

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27th Annual IEEE/SEMI International Electronics Manufacturing Technology SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Automatic wedge bonding with ribbon wire for high frequency applications

Optimizing test strategies during PCB design for boards with limited ICT access

Laser processing - the future of HDI manufacturing

A structured approach to lead-free IC assembly transitioning

Flux-underfill compatibility and failure mode analysis in high yield flip chip processing

Equivalent driver model for fast system simulation

Design and characterization of a high-performance wire-bond ball-grid-array package

Decision support for test and debug areas in RF manufacturing

Removable tape using thermoplastic adhesive for QFN assembly process

Solving wire bond process challenges for QFN packaging

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
Latest Publications