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27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
Latest Publications
TOTAL DOCUMENTS
73
(FIVE YEARS 0)
H-INDEX
6
(FIVE YEARS 0)
Published By IEEE
0780373014
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Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Laser processing - the future of HDI manufacturing
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032742
◽
2003
◽
Cited By ~ 3
Author(s):
S. Venkat
◽
T. Hannon
Keyword(s):
Laser Processing
◽
The Future
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A structured approach to lead-free IC assembly transitioning
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032758
◽
2003
◽
Cited By ~ 3
Author(s):
L. Nguyen
◽
R. Walberg
◽
Z. Lin
◽
T. Koh
◽
Y.Y. Bong
◽
...
Keyword(s):
Lead Free
◽
Structured Approach
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Automatic wedge bonding with ribbon wire for high frequency applications
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032732
◽
2003
◽
Cited By ~ 3
Author(s):
Ivy Wei Qin
◽
P. Reid
◽
R.E. Werner
◽
D. Doerr
Keyword(s):
High Frequency
◽
Wedge Bonding
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Optimizing test strategies during PCB design for boards with limited ICT access
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032780
◽
2003
◽
Cited By ~ 4
Author(s):
A. Verma
Keyword(s):
Test Strategies
◽
Pcb Design
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Decision support for test and debug areas in RF manufacturing
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032740
◽
2003
◽
Author(s):
S. Balasubramanian
◽
J. Arbulich
◽
J. Craik
◽
K. Srihari
Keyword(s):
Decision Support
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Flux-underfill compatibility and failure mode analysis in high yield flip chip processing
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032727
◽
2003
◽
Cited By ~ 2
Author(s):
P.N. Houston
◽
D.F. Baldwin
◽
W.M. Tsai
Keyword(s):
Failure Mode
◽
Flip Chip
◽
Mode Analysis
◽
High Yield
◽
Chip Processing
◽
Failure Mode Analysis
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Equivalent driver model for fast system simulation
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032765
◽
2003
◽
Author(s):
June Feng
◽
Ching-Chao Huang
Keyword(s):
System Simulation
◽
Driver Model
◽
Fast System
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Design and characterization of a high-performance wire-bond ball-grid-array package
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032762
◽
2003
◽
Author(s):
Ching-Chao Huang
◽
D. Secker
◽
Ling Yang
◽
June Feng
◽
Nirmal Jain
Keyword(s):
High Performance
◽
Ball Grid Array
◽
Wire Bond
◽
Ball Grid Array Package
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Removable tape using thermoplastic adhesive for QFN assembly process
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032750
◽
2003
◽
Cited By ~ 4
Author(s):
T. Kawai
◽
T. Nagoya
◽
H. Matsuura
Keyword(s):
Assembly Process
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Solving wire bond process challenges for QFN packaging
27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
◽
10.1109/iemt.2002.1032786
◽
2003
◽
Cited By ~ 1
Author(s):
E. McDivitt
Keyword(s):
Wire Bond
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