Flux-underfill compatibility and failure mode analysis in high yield flip chip processing

Author(s):  
P.N. Houston ◽  
D.F. Baldwin ◽  
W.M. Tsai
2015 ◽  
Vol 55 (8) ◽  
pp. 1234-1240 ◽  
Author(s):  
Yang Liu ◽  
Fenglian Sun ◽  
Hao Zhang ◽  
Tong Xin ◽  
Cadmus A. Yuan ◽  
...  

Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.


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