2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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9781538619285
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scholarly journals Co-design/simulation of flip-chip assembly for high voltage IGBT packages

2017 ◽  
Author(s):  
P. Rajaguru ◽  
C. Bailey ◽  
H. Lu ◽  
A. M. Aliyu ◽  
A. Castellazzi ◽  
...  
Keyword(s):  
High Voltage ◽  
Flip Chip ◽  
Flip Chip Assembly

Dynamic compact thermal model extraction for LED packages using model order reduction techniques

2017 ◽  
Author(s):  
Sangye Lungten ◽  
Robin Bornoff ◽  
James Dyson ◽  
Joseph M. L. Maubach ◽  
Wil H. A. Schilders ◽  
...  
Keyword(s):  
Thermal Model ◽  
Model Order Reduction ◽  
Order Reduction ◽  
Model Order ◽  
Model Extraction ◽  
Reduction Techniques

Manufacturing and characterisation of MEMS test nanostructures

2017 ◽  
Author(s):  
Grzegorz Jablonski ◽  
Pawel Janus ◽  
Piotr Pietrzak ◽  
Tomasz Torzewicz ◽  
Artur Sobczak ◽  
...  

Microelectronics thin films and boundaries characterized by local electro-thermal measurements

2017 ◽  
Author(s):  
Axel Pic ◽  
Sebastien Gallois-Garreignot ◽  
Vincent Fiori ◽  
Pierre-Olivier Chapuis
Keyword(s):  
Thin Films ◽  
Thermal Measurements
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