2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Hydrodynamics behaviour study of a Dual piezoelectric Cool Jet (DCJ) system on the thermal cooling of electronic casings

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233836 ◽

2017 ◽

Author(s):

Claudia Cadile ◽

Andreas Rumpf ◽

Dominique Elzo ◽

Jean-Pierre Fradin

Keyword(s):

Behaviour Study ◽

Thermal Cooling

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Effect of forward voltage change depending on gate voltage in body diode of SiC-MOSFET at thermal transient testing for analysing SiC power module package

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233809 ◽

2017 ◽

Cited By ~ 6

Author(s):

Fumiki Kato ◽

Hidekazu Tanisawa ◽

Kenichi Koui ◽

Shinji Sato ◽

Toru Aoki ◽

...

Keyword(s):

Gate Voltage ◽

Power Module ◽

Forward Voltage ◽

Voltage Change ◽

Thermal Transient

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Dynamic compact thermal model extraction for LED packages using model order reduction techniques

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233791 ◽

2017 ◽

Cited By ~ 3

Author(s):

Sangye Lungten ◽

Robin Bornoff ◽

James Dyson ◽

Joseph M. L. Maubach ◽

Wil H. A. Schilders ◽

...

Keyword(s):

Thermal Model ◽

Model Order Reduction ◽

Order Reduction ◽

Model Order ◽

Model Extraction ◽

Reduction Techniques

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Co-design/simulation of flip-chip assembly for high voltage IGBT packages

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233847 ◽

2017 ◽

Author(s):

P. Rajaguru ◽

C. Bailey ◽

H. Lu ◽

A. M. Aliyu ◽

A. Castellazzi ◽

...

Keyword(s):

High Voltage ◽

Flip Chip ◽

Flip Chip Assembly

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Practical thermal control by thermo-electric actuators

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233829 ◽

2017 ◽

Author(s):

Rob van Gils

Keyword(s):

Thermal Control ◽

Thermo Electric

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Design of experiments in thermal architecture

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233785 ◽

2017 ◽

Author(s):

Wendy Luiten

Keyword(s):

Design Of Experiments

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Microelectronics thin films and boundaries characterized by local electro-thermal measurements

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233808 ◽

2017 ◽

Author(s):

Axel Pic ◽

Sebastien Gallois-Garreignot ◽

Vincent Fiori ◽

Pierre-Olivier Chapuis

Keyword(s):

Thin Films ◽

Thermal Measurements

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Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233842 ◽

2017 ◽

Author(s):

Lisa Mitterhuber ◽

Stefan Defregger ◽

Julien Magnien ◽

Jordis Rose ◽

Franz Schrank ◽

...

Keyword(s):

Thermal Resistance ◽

Temperature Dependent ◽

Resistance Matrix ◽

Led Matrix

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Manufacturing and characterisation of MEMS test nanostructures

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233794 ◽

2017 ◽

Cited By ~ 1

Author(s):

Grzegorz Jablonski ◽

Pawel Janus ◽

Piotr Pietrzak ◽

Tomasz Torzewicz ◽

Artur Sobczak ◽

...

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Modification of thermal conductivity and phonon dispersion relation by means of phononic crystals

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2017.8233817 ◽

2017 ◽

Author(s):

M. Sledzinska ◽

A. El Sachat ◽

J. S. Reparaz ◽

M. R. Wagner ◽

F. Alzina ◽

...

Keyword(s):

Thermal Conductivity ◽

Dispersion Relation ◽

Phonon Dispersion ◽

Phononic Crystals ◽

Phonon Dispersion Relation

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2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Hydrodynamics behaviour study of a Dual piezoelectric Cool Jet (DCJ) system on the thermal cooling of electronic casings

Effect of forward voltage change depending on gate voltage in body diode of SiC-MOSFET at thermal transient testing for analysing SiC power module package

Dynamic compact thermal model extraction for LED packages using model order reduction techniques

Co-design/simulation of flip-chip assembly for high voltage IGBT packages

Practical thermal control by thermo-electric actuators

Design of experiments in thermal architecture

Microelectronics thin films and boundaries characterized by local electro-thermal measurements

Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix

Manufacturing and characterisation of MEMS test nanostructures

Modification of thermal conductivity and phonon dispersion relation by means of phononic crystals

Export Citation Format

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Hydrodynamics behaviour study of a Dual piezoelectric Cool Jet (DCJ) system on the thermal cooling of electronic casings

Effect of forward voltage change depending on gate voltage in body diode of SiC-MOSFET at thermal transient testing for analysing SiC power module package

Dynamic compact thermal model extraction for LED packages using model order reduction techniques

Co-design/simulation of flip-chip assembly for high voltage IGBT packages

Practical thermal control by thermo-electric actuators

Design of experiments in thermal architecture

Microelectronics thin films and boundaries characterized by local electro-thermal measurements

Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix

Manufacturing and characterisation of MEMS test nanostructures

Modification of thermal conductivity and phonon dispersion relation by means of phononic crystals

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications