2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
Latest Publications

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Published By IEEE

9781538644027

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Using electrical capacitance and mechanically representative hardware to evaluate the thermal mechanical stability of thermal interface materials

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357372 ◽

2018 ◽

Author(s):

Lauren Boston ◽

Andrew Yu ◽

Michael Gaynes

Keyword(s):

Mechanical Stability ◽

Thermal Interface Materials ◽

Electrical Capacitance ◽

Thermal Interface ◽

Interface Materials

In-plane thermal diffusivity measurement of highly thermal conductive thin films by the flash method

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357374 ◽

2018 ◽

Author(s):

Jozef Gembarovic ◽

Heng Wang ◽

Silviu Apostolescu ◽

Daniele Paganelli ◽

Piero Scotto

Keyword(s):

Thin Films ◽

Thermal Diffusivity ◽

Flash Method ◽

Thermal Diffusivity Measurement ◽

Diffusivity Measurement ◽

Conductive Thin Films

Thermal resistance of electrical insulation for bolted and clamped discrete power devices

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357371 ◽

2018 ◽

Author(s):

Mikel Garcia-Poulin ◽

Mehran Ahmadi ◽

Majid Bahrami ◽

Eric Lau ◽

Chris Botting

Keyword(s):

Thermal Resistance ◽

Electrical Insulation ◽

Power Devices

Application of thermal network approach to electrical-thermal co-simulation and chip-package-board extraction

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357345 ◽

2018 ◽

Cited By ~ 1

Author(s):

Fengyun Zhao ◽

Yuanbin Cai ◽

Zipeng Luo ◽

An-Yu Kuo ◽

Xin Ai ◽

...

Keyword(s):

Network Approach ◽

Thermal Network

Comparison of junction temperature prediction methods through analysis of isolated 1-D thermal resistance model variables of an application utilizing forced convection of heat sinks

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357362 ◽

2018 ◽

Author(s):

N. A. Klitzke ◽

S. C. Polzer ◽

W. L. Wilkins ◽

B. K. Gilbert ◽

C. R. Haider

Keyword(s):

Thermal Resistance ◽

Forced Convection ◽

Heat Sinks ◽

Junction Temperature ◽

Prediction Methods ◽

Temperature Prediction ◽

Resistance Model

Evaluation of pulsating heat pipes for outdoor telecom equipment

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357352 ◽

2018 ◽

Author(s):

Sobo Sun ◽

Rock Chin

Keyword(s):

Heat Pipes

Generative heatsink design for an automotive audio amplifier

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357379 ◽

2018 ◽

Cited By ~ 2

Author(s):

Robin Bornoff ◽

Brad Subat ◽

John Wilson

Keyword(s):

Audio Amplifier

Package thermal challenges due to changing mobile system form factors

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357359 ◽

2018 ◽

Author(s):

Cameron Nelson ◽

Jesse Galloway

Keyword(s):

Form Factors ◽

Mobile System ◽

System Form

Developing a ThetaJC standard for electronic packages

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357370 ◽

2018 ◽

Cited By ~ 1

Author(s):

Jesse Galloway ◽

Eduardo de los Heros

Keyword(s):

Electronic Packages

Design and optimization of contra-rotating fans

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2018.8357377 ◽

2018 ◽

Author(s):

Ralph Peter Mueller ◽

Oliver Velde ◽

Christian Friebe

Keyword(s):

Design And Optimization

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Using electrical capacitance and mechanically representative hardware to evaluate the thermal mechanical stability of thermal interface materials

In-plane thermal diffusivity measurement of highly thermal conductive thin films by the flash method

Thermal resistance of electrical insulation for bolted and clamped discrete power devices

Application of thermal network approach to electrical-thermal co-simulation and chip-package-board extraction

Comparison of junction temperature prediction methods through analysis of isolated 1-D thermal resistance model variables of an application utilizing forced convection of heat sinks

Evaluation of pulsating heat pipes for outdoor telecom equipment

Generative heatsink design for an automotive audio amplifier

Package thermal challenges due to changing mobile system form factors

Developing a ThetaJC standard for electronic packages

Design and optimization of contra-rotating fans

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
Latest Publications