Thermal Effects on TSV Signal Integrity

2014 ◽  
pp. 147-172
Author(s):  
Manho Lee ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Thermal Effects ◽  
Signal Integrity

Thermal effects on through-silicon via (TSV) signal integrity

2012 ◽  
Author(s):  
Manho Lee ◽  
Jonghyun Cho ◽  
Joohee Kim ◽  
Jun So Pak ◽  
Hyungdong Lee ◽  
...  
Keyword(s):  
Thermal Effects ◽  
Signal Integrity ◽  
Through Silicon Via

Thermal Considerations in Lens Regulator Systems

1970 ◽  
Vol 28 ◽  
pp. 358-359
Author(s):  
K.C. Newton
Keyword(s):  
Electron Microscope ◽  
Thermal Effects ◽  
Environmental Control ◽  
Reference Networks ◽  
Better Than

Thermal effects in lens regulator systems have become a major problem with the extension of electron microscope resolution capabilities below 5 Angstrom units. Larger columns with immersion lenses and increased accelerating potentials have made solutions more difficult by increasing the power being handled. Environmental control, component choice, and wiring design provide answers, however. Figure 1 indicates with broken lines where thermal problems develop in regulator systemsExtensive environmental control is required in the sampling and reference networks. In each case, stability better than I ppm/min. is required. Components with thermal coefficients satisfactory for these applications without environmental control are either not available or priced prohibitively.

Direct measurement of electron-diffraction-pattern intensities using an energy loss spectrometer

1989 ◽  
Vol 47 ◽  
pp. 668-669
Author(s):  
A. G. Jackson ◽  
M. Rowe
Keyword(s):  
Thermal Effects ◽  
Dynamic Range ◽  
Scattering Amplitude ◽  
Dynamical Theory ◽  
Site Symmetry ◽  
Proof Of Concept ◽  
Parallel Acquisition ◽  
Kinematic Approximation ◽  
Speed Up ◽  
Structure Calculations

Diffraction intensities from intermetallic compounds are, in the kinematic approximation, proportional to the scattering amplitude from the element doing the scattering. More detailed calculations have shown that site symmetry and occupation by various atom species also affects the intensity in a diffracted beam. [1] Hence, by measuring the intensities of beams, or their ratios, the occupancy can be estimated. Measurement of the intensity values also allows structure calculations to be made to determine the spatial distribution of the potentials doing the scattering. Thermal effects are also present as a background contribution. Inelastic effects such as loss or absorption/excitation complicate the intensity behavior, and dynamical theory is required to estimate the intensity value.The dynamic range of currents in diffracted beams can be 104or 105:1. Hence, detection of such information requires a means for collecting the intensity over a signal-to-noise range beyond that obtainable with a single film plate, which has a S/N of about 103:1. Although such a collection system is not available currently, a simple system consisting of instrumentation on an existing STEM can be used as a proof of concept which has a S/N of about 255:1, limited by the 8 bit pixel attributes used in the electronics. Use of 24 bit pixel attributes would easily allowthe desired noise range to be attained in the processing instrumentation. The S/N of the scintillator used by the photoelectron sensor is about 106 to 1, well beyond the S/N goal. The trade-off that must be made is the time for acquiring the signal, since the pattern can be obtained in seconds using film plates, compared to 10 to 20 minutes for a pattern to be acquired using the digital scan. Parallel acquisition would, of course, speed up this process immensely.

Experimental Study of Thermal Effects in the Sterilization of Disperse Systems

2001 ◽  
Vol 32 (4-6) ◽  
pp. 5
Author(s):  
A. A. Dolinsky ◽  
Yu. A. Shurchkova ◽  
B. I. Basok ◽  
T. S. Ryzhkova
Keyword(s):  
Experimental Study ◽  
Thermal Effects ◽  
Disperse Systems

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

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