2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits

2008 ◽

Author(s):

David Zhu ◽

S.P. Neo ◽

S. K Loh ◽

Eddie Er

Keyword(s):

Failure Analysis

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Scan-based ATPG diagnostic and optical techniques combination: A new approach to improve accuracy of defect isolation in functional logic failure

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588145 ◽

2008 ◽

Cited By ~ 2

Author(s):

A. Machouat ◽

G. Haller ◽

V. Goubier ◽

D. Lewis ◽

V. Pouget ◽

...

Keyword(s):

Optical Techniques ◽

New Approach ◽

Improve Accuracy ◽

Functional Logic ◽

Defect Isolation

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Raman-IR micro-thermography tool for reliability and failure analysis of electronic devices

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588160 ◽

2008 ◽

Cited By ~ 2

Author(s):

A. Sarua ◽

J. Pomeroy ◽

M. Kuball ◽

A. Falk ◽

G. Albright ◽

...

Keyword(s):

Failure Analysis ◽

Electronic Devices

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Trends and requirements of future high-performance CMOS

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588142 ◽

2008 ◽

Cited By ~ 1

Author(s):

Ali Khakifirooz ◽

Dimitri A. Antoniadis

Keyword(s):

High Performance

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TCAD solutions for submicron copper interconnect

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588158 ◽

2008 ◽

Author(s):

H. Ceric ◽

R. L. de Orio ◽

J. Cervenka ◽

S. Selberherr

Keyword(s):

Copper Interconnect

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Au nanocrystal flash memory reliability and failure analysis

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588190 ◽

2008 ◽

Cited By ~ 6

Author(s):

Pawan K. Singh ◽

Kaushal K. Singh ◽

Ralf Hofmann ◽

Karl Armstrong ◽

Nety Krishna ◽

...

Keyword(s):

Failure Analysis ◽

Flash Memory

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Improved image processing to enhance thermal laser stimulation signal

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588177 ◽

2008 ◽

Author(s):

A. Deyine-Barth ◽

K. Sanchez ◽

P. Perdu ◽

F. Beaudoin ◽

G. Benetti ◽

...

Keyword(s):

Image Processing ◽

Laser Stimulation

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The helium ion microscope for high resolution imaging, materials analysis and FA applications

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588149 ◽

2008 ◽

Cited By ~ 2

Author(s):

William B. Thompson ◽

John Notte ◽

Larry Scipioni ◽

Lewis Stern

Keyword(s):

High Resolution ◽

High Resolution Imaging ◽

Materials Analysis ◽

Helium Ion ◽

Resolution Imaging

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Conductive Atomic Force Microscopy failure analysis for SOI devices

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588162 ◽

2008 ◽

Cited By ~ 1

Author(s):

Lim Soon-Huat ◽

Zheng Xinhua ◽

Teo Chea-Wei ◽

Vinod Narang ◽

Teo Beng Hock ◽

...

Keyword(s):

Atomic Force Microscopy ◽

Failure Analysis ◽

Conductive Atomic Force Microscopy ◽

Force Microscopy ◽

Atomic Force ◽

Soi Devices

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Current-induced breakdown of carbon nanofiber interconnects

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2008.4588210 ◽

2008 ◽

Cited By ~ 1

Author(s):

Hirohiko Kitsuki ◽

Tsutomu Saito ◽

Toshishige Yamada ◽

Drazen Fabris ◽

Patrick Wilhite ◽

...

Keyword(s):

Carbon Nanofiber

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2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Application of FIB circuit edit combined with TIVA in advanced failure analysis

Scan-based ATPG diagnostic and optical techniques combination: A new approach to improve accuracy of defect isolation in functional logic failure

Raman-IR micro-thermography tool for reliability and failure analysis of electronic devices

Trends and requirements of future high-performance CMOS

TCAD solutions for submicron copper interconnect

Au nanocrystal flash memory reliability and failure analysis

Improved image processing to enhance thermal laser stimulation signal

The helium ion microscope for high resolution imaging, materials analysis and FA applications

Conductive Atomic Force Microscopy failure analysis for SOI devices

Current-induced breakdown of carbon nanofiber interconnects

Export Citation Format

2008 15th International Symposium on the Physical and Failure Analysis of Integrated CircuitsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Application of FIB circuit edit combined with TIVA in advanced failure analysis

Scan-based ATPG diagnostic and optical techniques combination: A new approach to improve accuracy of defect isolation in functional logic failure

Raman-IR micro-thermography tool for reliability and failure analysis of electronic devices

Trends and requirements of future high-performance CMOS

TCAD solutions for submicron copper interconnect

Au nanocrystal flash memory reliability and failure analysis

Improved image processing to enhance thermal laser stimulation signal

The helium ion microscope for high resolution imaging, materials analysis and FA applications

Conductive Atomic Force Microscopy failure analysis for SOI devices

Current-induced breakdown of carbon nanofiber interconnects

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Latest Publications