2013 IEEE International Interconnect Technology Conference - IITC
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Published By IEEE

9781479904402, 9781479904389

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Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615583 ◽

2013 ◽

Cited By ~ 4

Author(s):

Ho-Young Son ◽

Woong-Sun Lee ◽

Seung-Kwon Noh ◽

Min-Suk Suh ◽

Jae-Sung Oh ◽

...

Keyword(s):

Through Silicon Via ◽

Stacked Memory

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Origin of large contact resistance in organic field-effect transistors

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615588 ◽

2013 ◽

Author(s):

Takeo Minari ◽

Chuan Liu

Keyword(s):

Contact Resistance ◽

Field Effect ◽

Field Effect Transistors ◽

Organic Field Effect Transistors

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Intercalated multi-layer graphene grown by CVD for LSI interconnects

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615600 ◽

2013 ◽

Cited By ~ 7

Author(s):

Daiyu Kondo ◽

Haruhisa Nakano ◽

Bo Zhou ◽

Ichiro Kubota ◽

Kenjiro Hayashi ◽

...

Keyword(s):

Layer Graphene

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Interconnection requirements and multi-die integration for FPGAs

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615596 ◽

2013 ◽

Cited By ~ 1

Author(s):

A. Rahman ◽

J. Schulz ◽

R. Grenier ◽

K. Chanda ◽

M. J. Lee ◽

...

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Subtractive W contact and local interconnect co-integration (CLIC)

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615550 ◽

2013 ◽

Cited By ~ 2

Author(s):

Fei Liu ◽

Benjamin Fletcher ◽

Eric A. Joseph ◽

Yu Zhu ◽

Jemima Gonsalves ◽

...

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Spanning the spectrum of interconnects from trenches of double patterning to system level

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615549 ◽

2013 ◽

Author(s):

N S Nagaraj

Keyword(s):

System Level ◽

Double Patterning

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Thin nickel films growth using plasma enhanced atomic layer deposition from η3-2-methylallyl N, N'-diisopropylacetamidinate nickel(II)

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615573 ◽

2013 ◽

Author(s):

Jiro Yokota ◽

Clement Lansalot ◽

Changhee Ko

Keyword(s):

Atomic Layer Deposition ◽

Atomic Layer ◽

Nickel Films ◽

Layer Deposition ◽

Thin Nickel

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3D Integration challenges today from technological toolbox to industrial prototypes

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615598 ◽

2013 ◽

Cited By ~ 5

Author(s):

T. Mourier ◽

C. Ribiere ◽

G. Romero ◽

M. Gottardi ◽

N. Allouti ◽

...

Keyword(s):

3D Integration

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The electromigration short — Length effect and its impact on circuit reliability

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615553 ◽

2013 ◽

Cited By ~ 4

Author(s):

A. S. Oates

Keyword(s):

Circuit Reliability ◽

Length Effect

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Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation

2013 IEEE International Interconnect Technology Conference - IITC ◽

10.1109/iitc.2013.6615561 ◽

2013 ◽

Cited By ~ 3

Author(s):

Yue Zhang ◽

Li Zheng ◽

Muhannad S. Bakir

Keyword(s):

Power Dissipation ◽

3D Ics

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2013 IEEE International Interconnect Technology Conference - IITCLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages

Origin of large contact resistance in organic field-effect transistors

Intercalated multi-layer graphene grown by CVD for LSI interconnects

Interconnection requirements and multi-die integration for FPGAs

Subtractive W contact and local interconnect co-integration (CLIC)

Spanning the spectrum of interconnects from trenches of double patterning to system level

Thin nickel films growth using plasma enhanced atomic layer deposition from η3-2-methylallyl N, N'-diisopropylacetamidinate nickel(II)

3D Integration challenges today from technological toolbox to industrial prototypes

The electromigration short — Length effect and its impact on circuit reliability

Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation

2013 IEEE International Interconnect Technology Conference - IITC
Latest Publications