scholarly journals Real-Time Control of a Catalytic Solid in a Fixed-Bed Reactor Based on In Situ Spectroscopy

2007 ◽  
Vol 119 (28) ◽  
pp. 5508-5512 ◽  
Author(s):  
Simona M. Bennici ◽  
Bas M. Vogelaar ◽  
T. Alexander Nijhuis ◽  
Bert M. Weckhuysen
2007 ◽  
Vol 46 (28) ◽  
pp. 5412-5416 ◽  
Author(s):  
Simona M. Bennici ◽  
Bas M. Vogelaar ◽  
T. Alexander Nijhuis ◽  
Bert M. Weckhuysen

2003 ◽  
Vol 2003 (9) ◽  
pp. 255-276
Author(s):  
Anders Lynggaard-Jensen ◽  
Ida Rasmussen ◽  
Niels H. Eisum ◽  
Jørgen Steen-Pedersen

2008 ◽  
Vol 155 (11) ◽  
pp. D699 ◽  
Author(s):  
Lele Chen ◽  
Weinan Jiang ◽  
Todd Pao ◽  
Bill Lin ◽  
Linda Xu ◽  
...  

2002 ◽  
Vol 408 (1-2) ◽  
pp. 64-72 ◽  
Author(s):  
I.L. Eisgruber ◽  
B. Joshi ◽  
N. Gomez ◽  
J. Britt ◽  
T. Vincent

2005 ◽  
Vol 44 (8) ◽  
pp. 2716-2724 ◽  
Author(s):  
John D. Hedengren ◽  
Thomas F. Edgar

2010 ◽  
Vol 1249 ◽  
Author(s):  
Gregory E Menk ◽  
Sivakumar Dhandapani ◽  
Charles Chad Garretson ◽  
Shou-Sung Chang ◽  
Christopher Cocca ◽  
...  

AbstractChemical mechanical planarization (CMP) pads require conditioning to maintain the surfaces yielding optimal performance. However, conditioning not only regenerates the pad surface but also wears away the pad material and slurry transport grooves. Non-optimized conditioning may result in non-uniform pad profiles, limiting the productive lifetimes of pads. A new approach to conditioning uses closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.


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