scholarly journals In Situ Adaptive Tabulation for Real-Time Control

2005 ◽  
Vol 44 (8) ◽  
pp. 2716-2724 ◽  
Author(s):  
John D. Hedengren ◽  
Thomas F. Edgar
Keyword(s):  
Real Time ◽  
Real Time Control ◽  
Time Control ◽  
In Situ Adaptive Tabulation

scholarly journals Real-Time Control of a Catalytic Solid in a Fixed-Bed Reactor Based on In Situ Spectroscopy

2007 ◽  
Vol 46 (28) ◽  
pp. 5412-5416 ◽  
Author(s):  
Simona M. Bennici ◽  
Bas M. Vogelaar ◽  
T. Alexander Nijhuis ◽  
Bert M. Weckhuysen
Keyword(s):  
Real Time ◽  
Fixed Bed ◽  
Fixed Bed Reactor ◽  
In Situ Spectroscopy ◽  
Real Time Control ◽  
Time Control

IN-SITU NUTRIENT SENSORS FOR REAL-TIME CONTROL OF BIOLOGICAL NUTRIENT REMOVAL

2003 ◽  
Vol 2003 (9) ◽  
pp. 255-276
Author(s):  
Anders Lynggaard-Jensen ◽  
Ida Rasmussen ◽  
Niels H. Eisum ◽  
Jørgen Steen-Pedersen
Keyword(s):  
Real Time ◽  
Nutrient Removal ◽  
Biological Nutrient Removal ◽  
Real Time Control ◽  
Time Control

scholarly journals Real-Time Control of a Catalytic Solid in a Fixed-Bed Reactor Based on In Situ Spectroscopy

2007 ◽  
Vol 119 (28) ◽  
pp. 5508-5512 ◽  
Author(s):  
Simona M. Bennici ◽  
Bas M. Vogelaar ◽  
T. Alexander Nijhuis ◽  
Bert M. Weckhuysen
Keyword(s):  
Real Time ◽  
Fixed Bed ◽  
Fixed Bed Reactor ◽  
In Situ Spectroscopy ◽  
Real Time Control ◽  
Time Control

In Situ Monitoring and Real-Time Control of Gate Hardmask Etching in High-Volume Manufacturing of ICs

2008 ◽  
Vol 155 (11) ◽  
pp. D699 ◽  
Author(s):  
Lele Chen ◽  
Weinan Jiang ◽  
Todd Pao ◽  
Bill Lin ◽  
Linda Xu ◽  
...  
Keyword(s):  
Real Time ◽  
High Volume ◽  
In Situ Monitoring ◽  
Real Time Control ◽  
Time Control

In situ X-ray fluorescence used for real-time control of CuInxGa1−xSe2 thin film composition

2002 ◽  
Vol 408 (1-2) ◽  
pp. 64-72 ◽  
Author(s):  
I.L. Eisgruber ◽  
B. Joshi ◽  
N. Gomez ◽  
J. Britt ◽  
T. Vincent
Keyword(s):  
Thin Film ◽  
Real Time ◽  
Real Time Control ◽  
Film Composition ◽  
X Ray ◽  
Time Control

Real-time Control System for Improved CMP Pad Profiles

2010 ◽  
Vol 1249 ◽  
Author(s):  
Gregory E Menk ◽  
Sivakumar Dhandapani ◽  
Charles Chad Garretson ◽  
Shou-Sung Chang ◽  
Christopher Cocca ◽  
...  
Keyword(s):  
Real Time ◽  
Chemical Mechanical Planarization ◽  
Groove Depth ◽  
Real Time Control ◽  
New Approach ◽  
Loop Control ◽  
Time Control ◽  
Slurry Transport ◽  
Uniform Reduction

AbstractChemical mechanical planarization (CMP) pads require conditioning to maintain the surfaces yielding optimal performance. However, conditioning not only regenerates the pad surface but also wears away the pad material and slurry transport grooves. Non-optimized conditioning may result in non-uniform pad profiles, limiting the productive lifetimes of pads. A new approach to conditioning uses closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

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