Cure properties of self-extinguishing epoxy resin systems with microencapsulated latent catalysts for halogen-free semiconductor packaging materials

2009 ◽  
Vol 113 (1) ◽  
pp. 408-417 ◽  
Author(s):  
Whan Gun Kim
Keyword(s):  
Epoxy Resin ◽  
Packaging Materials ◽  
Halogen Free ◽  
Semiconductor Packaging

scholarly journals Preparation and Thermal Conductivity of Epoxy Resin/Graphene-Fe3O4 Composites

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2013
Author(s):  
Zhong Wu ◽  
Jingyun Chen ◽  
Qifeng Li ◽  
Da-Hai Xia ◽  
Yida Deng ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Epoxy Resin ◽  
Thermomechanical Properties ◽  
Packaging Materials ◽  
Mass Ratio ◽  
Degree Of Orientation ◽  
Ep Matrix ◽  
Electrical Insulation Properties

By modifying the bonding of graphene (GR) and Fe3O4, a stable structure of GR-Fe3O4, namely magnetic GR, was obtained. Under the induction of a magnetic field, it can be orientated in an epoxy resin (EP) matrix, thus preparing EP/GR-Fe3O4 composites. The effects of the content of GR and the degree of orientation on the thermal conductivity of the composites were investigated, and the most suitable Fe3O4 load on GR was obtained. When the mass ratio of GR and Fe3O4 was 2:1, the thermal conductivity could be increased by 54.8% compared with that of pure EP. Meanwhile, EP/GR-Fe3O4 composites had a better thermal stability, dynamic thermomechanical properties, and excellent electrical insulation properties, which can meet the requirements of electronic packaging materials.

scholarly journals Properties of Cured Epoxy Resin/Phenoxy Resin Containing Carboxylic Groups and Phosphorus Blends for Halogen-free Flame-retardancy FPC Adhesives

2013 ◽  
Vol 49 (1) ◽  
pp. 17-23
Author(s):  
Naoki YOKOYAMA ◽  
Osamu AMESAWA ◽  
Katsunori SEKIYA ◽  
Katsuyuki AIDA ◽  
Shigeaki TAUCHI
Keyword(s):  
Epoxy Resin ◽  
Flame Retardancy ◽  
Carboxylic Groups ◽  
Halogen Free

A novel halogen-free co-curing agent with linear multi-aromatic rigid structure as flame-retardant modifier in epoxy resin

2017 ◽  
Vol 29 (1) ◽  
pp. 603-611 ◽  
Author(s):  
Ting Chen ◽  
Xianming Chen ◽  
Meijie Wang ◽  
Peixin Hou ◽  
Cao Jie ◽  
...  
Keyword(s):  
Flame Retardant ◽  
Epoxy Resin ◽  
Curing Agent ◽  
Rigid Structure ◽  
Halogen Free
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